Amkor Technology, Inc.

Skyworks Solutions, Inc.

Amkor Technology Singapore Holding Pte. Ltd.

Anam Semiconductor Inc.

Amkor Technologies, Inc.

Bnr Inc.

Arnold Reisman

Iwona Turlik

Deepak Nayak

Lih-Tyng Hwang

Scott L. Jacobs

Neil M. Poley

Robert Francis Darveaux

Giora Dishon

Howard E Chen

Ronald Patrick Huemoeller

Anthony James Lobianco

Roger D St Amand

Louis W Nicholls

Hoang Mong Nguyen

Ki Wook Lee

Brett Arnold Dunlap

Lori Ann DeOrio

Miguel Angel Jimarez

Ju Hoon Yoon

Jae Dong Kim

David McCann

John McCormick

Michael Barrow

Dae Keun Park

Jin Seong Kim

Sung Jin Yang

David Bolognia

Woon Kab Jung

Pablo Rodriguez

James M Fusaro

Sukianto Rusli

Russ Alan Reisner

Matthew Sean Read

Vladimir Perelman

Bruce J Freyman

Bhuvaneshwaran Vijayakumar

Young Ho Kim

Dinhphuoc Vu Hoang

Ludovico Estrada Bancod

David Viveiros, Jr

Lee John Smith

Arsenio De Guzman

Yi Liu

Timothy Lee Olson

Hardik Bhupendra Modi

Christopher J Berry

Vincent DiCaprio

Stephen Joseph Kovacic

Akito Yoshida

Bob Shih-Wei Kuo

Barry M Miles

Young Wook Heo

Foad Arfaei Malekzadeh

Nozad Karim

John C Baldwin

Takeshi Furusawa

Sundeep Nand Nangalia

Il Kwon Shim

Jong Ok Chun

Neil M Poley

Jonathon Greenwood

Alexander William Copia

Jon G Aday

Joseph Marco Longo

Jingkun Mao

Jicheng Yang

René Rodriguez

Marnie Ann Mattei

Frederick J G Hamilton

Bruce M Guenin

Bruce Joseph Freyman

Scott L Jacobs

A method for manufacturing an electronic package comprises providing at least one electronic component, the at least one electronic component including at least one non-groundable thermal output, providing a substrate in which a ground plane is enclosed in or supported by the substrate, defining at least one thermally conductive pathway extending between an interface exposed on the substrate and the ground plane such that the interface is electrically isolated from the ground plane, and mounting the electronic component to the substrate, the mounting including thermally coupling the output to the interface with at least one thermally conductive member.

Method of transferring heat from ungrounded electronic components

In some embodiments, a method for manufacturing packaged radio-frequency devices includes: providing a packaging substrate configured to receive a plurality of components, including a first side and a second side; mounting a first component on the first side of the packaging substrate; implementing a first overmold structure on the first side of the packaging substrate, substantially encapsulating the first component; mounting a second component on the second side of the packaging substrate, the second component being located in an area of the second side where one or more redundant pins, a redundant ground pad, or a redundant portion of a ground pad may be located; implementing a set of through-mold connections on the second side of the packaging substrate, the set of through-mold connections including signal pins and ground pins; and implementing a second overmold structure substantially encapsulating one or more of the component or the set of through-mold connections.

Methods related to dual-sided module with land-grid array (LGA) footprint

An electronic component package includes a substrate having an upper surface. Traces on the upper surface of the substrate extend in a longitudinal direction. The traces have a first latitudinal width in a latitudinal direction, the latitudinal direction being perpendicular to the longitudinal direction. Rectangular copper pillars are attached to bond pads of an electronic component, the copper pillars having a longitudinal length and a latitudinal second width. The latitudinal second width of the copper pillars is equal to and aligned with the first latitudinal width of the traces. Further, the longitudinal length of the copper pillars is parallel with the longitudinal direction of the trace and equal to the length of the bond pads. The copper pillars are mounted to the traces with solder joints.

Fine pitch copper pillar package and method

Signal isolation for module with ball grid array. In some embodiments, a packaged module can include a packaging substrate having an underside, and an arrangement of conductive features implemented on the underside of the packaging substrate to allow the packaged module to be capable of being mounted on a circuit board. The arrangement of conductive features can include a signal feature implemented at a first region and configured for passing of a signal, and one or more shielding features placed at a selected location relative to the signal feature to provide an enhanced isolation between the signal feature and a second region of the underside of the packaging substrate.

Packaged module with ball grid array and grounding pins for signal isolation, method of manufacturing the same, and wireless device comprising the same

A stackable package is placed within a mold during an encapsulation operation. A compliant surface, e.g., of a compliant film, of the mold is pressed down on upper interconnection balls of the stackable package to force upper portions of the upper interconnection balls into the mold. However, lower portions of the upper interconnection balls are exposed within a space between the compliant surface and a substrate of the stackable package. The space is filled with a dielectric material to form a package body. The package body is formed while at the same time exposing the upper portions of upper interconnection balls from the package body in a single encapsulation operation. By avoiding selective removal of the package body to expose the upper interconnection balls, the number of operations as well as cost to manufacture the stackable package is minimized.

Stackable package and method

A packaging substrate can include a first surface and a second opposing surface, the first surface including a first mounting region of a first electronic module region and the second opposing surface including a first electrical contacts region of the first electronic module region. The packaging substrate can include a saw street region with at least a portion that surrounds the first electronic module region, and a saw street feature formed on the second opposing surface within at least a portion of the saw street region, the saw street feature being a solder mask layer over a metal layer.

Reduction of packaging substrate deformation

A packaged radio-frequency device is disclosed, including a packaging substrate configured to receive one or more components, the packaging substrate including a first side and a second side. A shielded package may be implemented on the first side of the packaging substrate, the shielded package including a first circuit and a first overmold structure, the shielded package configured to provide radio-frequency shielding for at least a portion of the first circuit. A set of through-mold connections may be implemented on the second side of the packaging substrate, the set of through-mold connections defining a mounting volume on the second side of the packaging substrate. The device may include a component implemented within the mounting volume and a second overmold structure substantially encapsulating one or more of the component or the set of through-mold connections.

Devices and methods related to dual-sided radio-frequency package with overmold structure

A packaged radio-frequency device can include a packaging substrate configured to receive one or more components, the packaging substrate including a first side and a second side. The packaging substrate may include a first component mounted on the first side and a first overmold structure implemented on the first side, the first overmold structure substantially encapsulating the first component. The packaging substrate may further include a set of through-mold connections implemented on the second side of the packaging substrate, the set of through-mold connections including signal pins and ground pins, a second component mounted on the second side of the packaging substrate, the second component being located in an area of the second side configured to implement a redundant ground pad or a redundant portion of a ground pad, and a second overmold structure substantially encapsulating one or more of the second component or the set of through-mold connections.

Devices related to dual-sided module with land-grid array (LGA) footprint

Devices and methods related to nested filters. In some embodiments, a radio-frequency device can include a substrate, and first and second filter devices mounted on the substrate with respective support structures, such that at least a portion of the second filter device is positioned in a space defined by an underside of the first filter device and the support structures for the first filter device. Such a radio-frequency device can be, for example, a packaged module for use in an electronic device such as a wireless device.

Devices and methods related to nested filters

A packaging substrate can include a first surface and a second opposing surface, the first surface having a mounting region configured to receive electronic components, and electrical contacts formed on the second opposing surface. A saw street region can surround the mounting region and the electrical contacts, a metal layer and a solder mask layer being formed within the saw street region on the second opposing surface, and the solder mask layer being formed over the metal layer. An electronic module can include a packaging substrate including a first surface and a second opposing surface, the first surface including a mounting region. A plurality of electronic components can be mounted on the mounting region. A ground pad can be formed on the second opposing surface of the packaging substrate, the ground pad including a solder mask layer formed thereon, the solder mask layer having a plurality of openings.

Methods and devices related to reduced packaging substrate deformation

A fingerprint sensor package, including a sensing side for sensing fingerprint information and a separate connection side for electrically connecting the fingerprint sensor package to a host device, is disclosed. The fingerprint sensor package can also include a sensor integrated circuit facing the sensing side and substantially surrounded by a fill material. The fill material includes vias at peripheral locations around the sensor integrated circuit. The fingerprint sensor package can further include a redistribution layer on the sensing side which redistributes connections of the sensor integrated circuit to the vias. The connections can further be directed through the vias to a ball grid array on the connection side. Some aspects also include electrostatic discharge traces positioned at least partially around a perimeter of the connection side. Methods of manufacturing are also disclosed.

Packaging for fingerprint sensors and methods of manufacture

A package includes a substrate having an electronic component flip chip mounted thereto by flip chip bumps. The electronic component includes an active surface and an inactive surface. Electrically conductive columns (TSV) extend through the electronic component between the active surface and the inactive surface. A RDL structure is coupled to the inactive surface, the RDL structure redistributing the pattern of the electrically conductive columns at the inactive surface to a pattern of inactive surface RDL lands. The inactive surface RDL lands are exposed through via apertures of a package body. By using the inactive surface of the electronic component to distribute the inactive surface RDL lands, the allowable size of the electronic component is maximized.

Methods and structures for increasing the allowable die size in TMV packages

Disclosed herein are methods of fabricating a packaged radio-frequency (RF) device. The disclosed methods use a film during fabrication to control the distribution of an under-fill material between one or more components and a packaging substrate. The method includes mounting components to a first side of a packaging substrate and applying a film to a second side of a packaging substrate. The method also includes mounting a lower component to the second side of the packaging substrate and under-filling the lower component mounted on the second side of the packaging substrate with an under-filling agent. The method also includes removing the film on the second side of the packaging substrate and mounting solder balls to the second side of the packaging substrate after removal of the film.

Control of under-fill using a film during fabrication for a dual-sided ball grid array package

Packaged module having a ball grid array with grounding shielding pins for electromagnetic isolation, method of manufacturing the same, and wireless device comprising the same

Described herein are methods of manufacturing dual-sided packaged electronic modules to control the distribution of an under-fill material between one or more components and a packaging substrate. The disclosed technologies include using a dam on a packaging substrate that is configured to prevent or limit the flow of a capillary under-fill material. This can prevent or limit the capillary under-fill material from flowing onto or contacting other components or elements on the packaging substrate, such as solder balls of a ball-grid array. Accordingly, the disclosed technologies control under-fill for dual-sided ball grid array packages using a dam on a packaging substrate.

Control of under-fill using a dam on a packaging substrate for a dual-sided ball grid array package

Growing community of inventors

Gilbert, AZ, United States of America

Robert Francis Darveaux