The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 06, 2026
Filed:
Feb. 21, 2023
Skyworks Solutions, Inc., Irvine, CA (US);
Bhuvaneshwaran Vijayakumar, Irvine, CA (US);
Robert Francis Darveaux, Corona Del Mar, CA (US);
Lori Ann Deorio, Irvine, CA (US);
SKYWORKS SOLUTIONS, INC., Irvine, CA (US);
Abstract
A method for manufacturing an electronic package comprises providing at least one electronic component, the at least one electronic component including at least one non-groundable thermal output, providing a substrate in which a ground plane is enclosed in or supported by the substrate, defining at least one thermally conductive pathway extending between an interface exposed on the substrate and the ground plane such that the interface is electrically isolated from the ground plane, and mounting the electronic component to the substrate, the mounting including thermally coupling the output to the interface with at least one thermally conductive member.