Lori Ann DeOrio

Title: Lori Ann DeOrio: Innovator in Packaging and Wireless Technology

Introduction

Lori Ann DeOrio is a prominent inventor based in Irvine, CA, known for her significant contributions to packaging substrates and wireless technology. With a remarkable portfolio of 17 patents, she has made a lasting impact in her field. Her innovative designs and solutions have paved the way for advancements in electronic module packaging and radio frequency devices.

Latest Patents

Among her latest patents is the "Reduction of Packaging Substrate Deformation," which addresses the challenges of packaging substrates in electronic modules. This invention features a substrate with a first surface that includes a mounting region for an electronic module and a second surface with electrical contacts. The design incorporates a saw street region that surrounds the electronic module, enhancing the structural integrity of the packaging.

Another notable patent is for "Radio Frequency Modules," which details packaged modules intended for wireless devices. This invention supports integrated circuit die that includes components of both baseband and front-end systems, along with an oscillator assembly and antenna. The design emphasizes vertical integration to optimize space and reduce trace lengths, while also incorporating shielding to protect against radio frequency interference.

Career Highlights

Lori Ann DeOrio has built her career at Skyworks Solutions, Inc., where she has been instrumental in developing cutting-edge technologies. Her work has not only advanced the company's product offerings but has also contributed to the broader field of wireless communication and electronic packaging.

Collaborations

Throughout her career, Lori has collaborated with talented individuals such as Darren Roger Frenette and George Khoury. These partnerships have fostered innovation and creativity, leading to the successful development of her patented technologies.

Conclusion

Lori Ann DeOrio stands out as a leading inventor in the fields of packaging and wireless technology. Her extensive patent portfolio and innovative contributions continue to shape the future of electronic devices.