The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 20, 2021

Filed:

Apr. 02, 2018
Applicant:

Skyworks Solutions, Inc., Irvine, CA (US);

Inventors:

Dinhphuoc Vu Hoang, Anaheim, CA (US);

Robert Francis Darveaux, Corona Del Mar, CA (US);

Anthony James LoBianco, Irvine, CA (US);

Lori Ann DeOrio, Irvine, CA (US);

Hoang Mong Nguyen, Fountain Valley, CA (US);

Ki Wook Lee, Irvine, CA (US);

Hardik Bhupendra Modi, Irvine, CA (US);

Foad Arfaei Malekzadeh, Ottawa, CA;

Stephen Joseph Kovacic, Ottawa, CA;

René Rodriguez, Rancho Santa Margarita, CA (US);

Assignee:

Skyworks Solutions, Inc., Irvine, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 9/04 (2006.01); B29C 41/42 (2006.01); H01Q 5/35 (2015.01); H01Q 9/06 (2006.01); H01Q 1/52 (2006.01); B29L 31/34 (2006.01); H01Q 1/38 (2006.01); H01Q 21/06 (2006.01); H01Q 1/22 (2006.01);
U.S. Cl.
CPC ...
H01Q 9/0407 (2013.01); B29C 41/42 (2013.01); H01Q 5/35 (2015.01); H01Q 9/065 (2013.01); B29L 2031/3456 (2013.01); H01Q 1/2283 (2013.01); H01Q 1/38 (2013.01); H01Q 1/526 (2013.01); H01Q 21/065 (2013.01);
Abstract

A method for manufacturing a package with a conformal shield antenna includes forming a mold compound layer, attaching the mold compound layer to a printed circuit board, applying a conformal shield layer on a first surface of the mold compound layer, the mold compound layer disposed between the conformal shield layer and the printed circuit board module, and shaping the conformal shield layer to define a planar antenna structure. Optionally, the method includes forming a cavity in the mold compound layer, applying a cover layer over the cavity to enclose the cavity and hardening the cover layer.


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