The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 13, 2021

Filed:

Dec. 18, 2019
Applicant:

Skyworks Solutions, Inc., Woburn, MA (US);

Inventors:

Anthony James Lobianco, Irvine, CA (US);

Howard E. Chen, Anaheim, CA (US);

Robert Francis Darveaux, Corona Del Mar, CA (US);

Hoang Mong Nguyen, Fountain Valley, CA (US);

Matthew Sean Read, Foothill Ranch, CA (US);

Lori Ann Deorio, Irvine, CA (US);

Assignee:

Skyworks Solutions, Inc., Irvine, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 3/28 (2006.01); B23K 26/40 (2014.01); B23K 26/361 (2014.01); B23K 26/382 (2014.01); H04B 1/3827 (2015.01); H05K 1/18 (2006.01); B23K 26/362 (2014.01); B23K 26/386 (2014.01); H01L 21/56 (2006.01); H01L 21/768 (2006.01); H01L 23/31 (2006.01); H01L 23/48 (2006.01); H01L 23/498 (2006.01); H01L 23/552 (2006.01); H01L 23/66 (2006.01); H05K 3/30 (2006.01); H05K 9/00 (2006.01); H03H 9/64 (2006.01); H04B 1/40 (2015.01); B23K 103/16 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0218 (2013.01); B23K 26/361 (2015.10); B23K 26/362 (2013.01); B23K 26/386 (2013.01); B23K 26/389 (2015.10); B23K 26/40 (2013.01); H01L 21/565 (2013.01); H01L 21/76802 (2013.01); H01L 21/76877 (2013.01); H01L 23/3121 (2013.01); H01L 23/481 (2013.01); H01L 23/49838 (2013.01); H01L 23/552 (2013.01); H01L 23/66 (2013.01); H03H 9/64 (2013.01); H04B 1/3833 (2013.01); H04B 1/3838 (2013.01); H04B 1/40 (2013.01); H05K 1/0216 (2013.01); H05K 1/0243 (2013.01); H05K 1/181 (2013.01); H05K 1/183 (2013.01); H05K 3/288 (2013.01); H05K 3/30 (2013.01); H05K 3/303 (2013.01); H05K 9/0022 (2013.01); B23K 2103/172 (2018.08); H01L 24/17 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 24/73 (2013.01); H01L 2223/6611 (2013.01); H01L 2223/6616 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/05554 (2013.01); H01L 2224/13025 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/4813 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/49171 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/19107 (2013.01); H01L 2924/3025 (2013.01); H05K 2201/1006 (2013.01); H05K 2201/1056 (2013.01); H05K 2201/10083 (2013.01); H05K 2201/10098 (2013.01); H05K 2201/10287 (2013.01); H05K 2203/107 (2013.01); H05K 2203/1327 (2013.01); Y10T 29/49002 (2015.01); Y10T 29/49016 (2015.01);
Abstract

Apparatus related to conformal coating implemented with surface mount devices. In some embodiments, a radio-frequency (RF) module includes a packaging substrate configured to receive a plurality of components. The RF also includes a surface mount device (SMD) mounted on the packaging substrate, the SMD including a metal layer that faces upward when mounted. The RF module further includes an overmold formed over the packaging substrate, the overmold dimensioned to cover the SMD. The RF module further includes an opening defined by the overmold at a region over the SMD, the opening having a depth sufficient to expose at least a portion of the metal layer. The RF module further includes a conformal conductive layer formed over the overmold, the conformal conductive layer configured to fill at least a portion of the opening to provide an electrical path between the conformal conductive layer and the metal layer of the SMD.


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