The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 14, 2020

Filed:

Apr. 08, 2019
Applicant:

Skyworks Solutions, Inc., Woburn, MA (US);

Inventors:

Darren Roger Frenette, Pakenham, CA;

George Khoury, Ottawa, CA;

Lori Ann DeOrio, Irvine, CA (US);

Assignee:

Skyworks Solutions, Inc., Woburn, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/66 (2006.01); H01L 25/065 (2006.01); H01L 25/00 (2006.01); H01L 25/16 (2006.01); H04B 1/40 (2015.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01L 23/66 (2013.01); H01L 25/16 (2013.01); H01L 25/50 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48145 (2013.01); H01L 2224/73265 (2013.01); H01L 2225/06568 (2013.01); H01L 2225/06575 (2013.01); H01L 2225/06582 (2013.01); H01L 2924/19105 (2013.01); H04B 1/40 (2013.01);
Abstract

Methods to form stacked circuit assemblies include mounting a first wireless device component to a first surface of a substrate and placing a second wireless device component over the first wireless device component such that the first wireless device component is disposed between the second wireless device component and the first surface of the substrate such that a first overhanging portion of the second wireless device component extends beyond a periphery of the first wireless device component. The first wireless device component is in communication with the second wireless device component and second wireless device component is in communication with the substrate.


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