The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 13, 2024
Filed:
Jul. 21, 2021
Utac Headquarters Pte. Ltd., Singapore, SG;
Saravuth Sirinorakul, Bangkok, TH;
Il Kwon Shim, Singapore, SG;
Kok Chuen Lock, Dongguan, CN;
Roel Adeva Robles, Singapore, SG;
Eakkasit Dumsong, Bangkok, TH;
UTAC HEADQUARTERS PTE. LTD., Singapore, SG;
Abstract
The present disclosure is directed to improving EMI shielding to provide more reliable semiconductor packages. The semiconductor package may be, for example, a lead frame including one or multiple dies attached thereto. The semiconductor package may include only wire bonds or a combination of clip bonds and wire bonds. An integrated shielding structure may be disposed in between the package substrate and the encapsulant to shield internal and/or external EMI. For example, a top surface of the integrated shield structure is exposed.