For the Inventor, By the Inventor

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Singapore, Singapore

Utac Headquarters Pte. Ltd.

USPTO Granted Patents = 66

Trademarks = 3

Forward Citations = 98

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104 inventors (with patents filed for the assignee):

Saravuth Sirinorakul (29 out of 76 patents)

Suebphong Yenrudee (14 out of 16 patents)

Hua Hong Tan (10 out of 11 patents)

4. Nathapong Suthiwongsunthorn (10 out of 37 patents)

5. Roel Adeva Robles (8 out of 9 patents)

6. Il Kwon Shim (7 out of 202 patents)

7. Kriangsak Sae Le (6 out of 10 patents)

8. Jeffrey Punzalan (6 out of 6 patents)

9. Wedanni Linsangan Micla (5 out of 5 patents)

10. Antonio Bambalan Dimaano, Jr (5 out of 32 patents)

11. Somchai Nondhasitthichai (5 out of 35 patents)

12. Rui Huang (5 out of 87 patents)

13. Beng Yeung Ho (5 out of 6 patents)

14. Chee Kay Chow (4 out of 4 patents)

15. Teddy Joaquin Carreon (4 out of 4 patents)

Core Competencies:

Semiconductor Devices

Optical Semiconductor Packages

Electrical Interconnects

Semiconductor Package Testing

Vertical Passive Components

Integrated Shielding

Hermetic Semiconductor Packages

Electromagnetic Interference Shielding

Multi-Layer Leadless Packages

Image Sensor Packages

Conductive Bonding Layers

Clip Bond Packages

66 patents: Sort by Forward Citations

1. 12489078 - Semiconductor device and method of disposing electrical components above and below substrate (2025-12-02),

2. 12302657 - Semiconductor device and method of forming an optical semiconductor package with a shield structure (2025-05-13),

3. 12293972 - Semiconductor device and method of forming leadframe with clip bond for electrical interconnect (2025-05-06),

4. 12230615 - Semiconductor packages with vertical passive components (2025-02-18),

5. 12228610 - Illuminator method and device for semiconductor package testing (2025-02-18),

6. 12211863 - Reliable semiconductor packages (2025-01-28),

7. 12166050 - Reliable semiconductor packages (2024-12-10),

8. 12165921 - Wafer adaptor for adapting different sized wafers (2024-12-10),

9. 12100719 - Reliable semiconductor packages (2024-09-24),

10. 12021096 - Reliable semiconductor packages (2024-06-25),

11. 11945004 - System and method of cleaning and inspecting semiconductor die carrier (2024-04-02),

12. 11901308 - Semiconductor packages with integrated shielding (2024-02-13),

13. 11881494 - Semiconductor package with dams (2024-01-23),

14. 11804416 - Semiconductor device and method of forming protective layer around cavity of semiconductor die (2023-10-31),

15. 11784102 - Hermetic semiconductor packages (2023-10-10),

UTAC is a leading provider of semiconductor assembly and test services for a wide range of applications, serving global customers in the automotive, industrial, and consumer markets. With a comprehensive suite of services, UTAC offers innovative solutions that help customers bring their products to market faster and more efficiently.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 30 2025

66 Patents

#43 in Singapore

#43 in Singapore

#10,736 in the World

Singapore, Singapore

Utac Headquarters Pte. Ltd.

Forward Citations = 98

104 inventors:

Saravuth Sirinorakul (29 out of 76 patents)

Suebphong Yenrudee (14 out of 16 patents)

Hua Hong Tan (10 out of 11 patents)

4. Nathapong Suthiwongsunthorn (10 out of 37 patents)

5. Roel Adeva Robles (8 out of 9 patents)

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