The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 14, 2026
Filed:
Dec. 01, 2022
Applicant:
Utac Headquarters Pte. Ltd., Singapore, SG;
Inventors:
Dzafir Bin Mohd Shariff, Singapore, SG;
Il Kwon Shim, Singapore, SG;
Enrique E. Sarile, Jr., Singapore, SG;
Jackson Fernandez Rosario, Singapore, SG;
Ronnie M. De Villa, Singapore, SG;
Chan Loong Neo, Singapore, SG;
Assignee:
UTAC HEADQUARTERS PTE. LTD., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10P 72/70 (2026.01); B23K 26/38 (2014.01); H10P 50/24 (2026.01); H10P 54/00 (2026.01);
U.S. Cl.
CPC ...
H10P 72/7402 (2026.01); B23K 26/38 (2013.01); H10P 50/242 (2026.01); H10P 54/00 (2026.01); H10P 72/7416 (2026.01);
Abstract
Reliable plasma dicing of a wafer with a die attach film (DAF) to the bottom wafer surface to singulate it into individual dies is disclosed. Laser processing is employed to form mask openings in a passivation stack of a processed wafer to serve as a dicing mask. A combination of plasma dicing and laser cutting is employed. Plasma is employed to etch the wafer while laser is employed to cut the DAF.