Singapore, Singapore

Ronnie M De Villa

This inventor holds 6 USPTO granted patents and 5 published patent applications. Top assignee: Utac Headquarters Pte. Ltd.. Active years: 2023-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ronnie M De Villa. Retrieved from https://idiyas.com/inventor/ronnie-m-de-villa

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 6 

% Patents Active = 16.7

Average Co-Inventor Count = 4.8

ph-index = 1


Company Filing History:


Years Active: 2023-2026

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6 patents (USPTO):Explore Patents

Title: Innovations of Ronnie M De Villa

Introduction

Ronnie M De Villa is a notable inventor based in Singapore, known for his contributions to the field of plasma dicing technology. With a total of 6 patents to his name, he has made significant advancements in methods that enhance the reliability and efficiency of wafer processing.

Latest Patents

One of his latest patents, titled "Plasma diced wafers and methods thereof," focuses on reliable plasma dicing of wafers to singulate them into individual dies. This innovative method employs laser processing to create mask openings in a passivation stack of a processed wafer. The patterned passivation stack acts as a plasma dicing mask, allowing for precise dicing of the wafer. The design of the mask openings can feature flat, vertical, slanted, or chamfered sidewalls. The process includes two plasma etch steps, where the first step creates scalloped sidewalls on a portion of the die, while the second step forms flat or vertical sidewalls on another portion. This technique effectively prevents backside notching, thereby improving the reliability of the diced wafers.

Another significant patent by De Villa also addresses plasma dicing of a processed wafer with a die attach film (DAF) attached to the bottom surface. This method utilizes laser processing to form mask openings in the passivation stack, which serves as a dicing mask. Additionally, it creates a modified layer with cracks on the bottom portion of the wafer. The plasma dicing process partially dices the wafer to the modified layer, facilitating the singulation of individual dies.

Career Highlights

Ronnie M De Villa is currently employed at Utac Headquarters Pte. Ltd., where he continues to innovate in the field of semiconductor technology. His work has significantly impacted the efficiency and reliability of wafer processing techniques.

Collaborations

Throughout his career, De Villa has collaborated with talented individuals such as Dzafir Bin Mohd Shariff and Il Kwon Shim, contributing to various projects that enhance the capabilities of plasma dicing technology.

Conclusion

Ronnie M De Villa's contributions to the field of plasma dicing have established him as a prominent inventor in Singapore. His innovative patents reflect a commitment to improving wafer processing methods, ensuring greater reliability and efficiency in the semiconductor industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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