The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 11, 2026
Filed:
Feb. 27, 2023
Utac Headquarters Pte. Ltd., Singapore, SG;
Dzafir Bin Mohd Shariff, Singapore, SG;
Enrique E. Sarile, Jr., Singapore, SG;
Jackson Fernandez Rosario, Singapore, SG;
Ronnie M. De Villa, Singapore, SG;
Chan Loong Neo, Singapore, SG;
Il Kwon Shim, Singapore, SG;
UTAC Headquarters Pte. Ltd., Singapore, SG;
Abstract
Reliable plasma dicing of a processed wafer with a die attach film (DAF) attached to the bottom wafer surface to singulate it into individual dies is disclosed. Laser processing is employed to form mask openings in a passivation stack of a processed wafer to serve as a dicing mask. Laser processing is employed to form a modified layer with cracks on a bottom portion of the wafer. Plasma dicing partially dices the processed wafer to about the modified layer. The dicing tape is expanded laterally away from the center of the partially diced processed wafer, singulating it into individual dies. Singulation of the partially plasma diced processed wafer is facilitated by the modified layer.