The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 25, 2023
Filed:
Oct. 15, 2020
Applicant:
Utac Headquarters Pte. Ltd., Singapore, SG;
Inventors:
Enrique Jr Sarile, Singapore, SG;
Dzafir Bin Mohd Shariff, Singapore, SG;
Seung Geun Park, Singapore, SG;
Ronnie M. De Villa, Singapore, SG;
Zhong Hai Wang, Singapore, SG;
Assignee:
UTAC Headquarters Pte. Ltd, Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/78 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/78 (2013.01); H01L 23/3192 (2013.01); H01L 23/564 (2013.01);
Abstract
A semiconductor package is disclosed. The semiconductor package includes a substrate with a first surface, a second surface and sidewalls. The package also includes backside metallization (BSM) over the second surface of the substrate. The semiconductor package is devoid of metal debris.