The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 13, 2025

Filed:

May. 23, 2022
Applicant:

Utac Headquarters Pte. Ltd., Singapore, SG;

Inventors:

Emmanuel Espiritu, Singapore, SG;

Il Kwon Shim, Singapore, SG;

Jeffrey Punzalan, Singapore, SG;

Teddy Joaquin Carreon, Singapore, SG;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/146 (2006.01); H01L 23/31 (2006.01); H10F 39/00 (2025.01);
U.S. Cl.
CPC ...
H10F 39/8057 (2025.01); H01L 23/3157 (2013.01); H10F 39/011 (2025.01); H10F 39/804 (2025.01); H10F 39/8063 (2025.01); H10F 39/811 (2025.01);
Abstract

A semiconductor device has a substrate. A semiconductor die including a photosensitive circuit is disposed over the substrate. A shield is disposed over the substrate and semiconductor die with a first opening of the shield disposed over the photosensitive circuit. An outer section of the shield is attached to the substrate and includes a second opening. An encapsulant is deposited over the substrate and semiconductor die. The encapsulant extends into the first opening and a first area between the shield and substrate while a second area over the photosensitive circuit remains devoid of the encapsulant.


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