Emmanuel Espiritu

This inventor holds 54 USPTO granted patents and 4 published patent applications, primarily in Integrated Circuit Packaging (CPC class H01L). Top assignees: Stats Chippac Pte. Ltd., Utac Headquarters Pte. Ltd.. Active years: 2008-2025.

USPTO Granted Patents = 54 (Patent Applications = 4)

% Patents Active = 100.0

Average Co-Inventor Count = 3.6

ph-index = 8

Forward Citations = 298(Granted Patents)

Forward Citations (Not Self Cited) = 286(Dec 10, 2025)

Inventors with similar research interests:

Company Filing History:

52 out of 1,842

Stats Chippac Pte. Ltd.

patents

2 out of 78

Utac Headquarters Pte. Ltd.

patents

Years Active: 2008-2025

Loading Chart...

Areas of Expertise:

Integrated Circuit

Packaging System

Interposer Structure

Bump Contacts

Lead Frame

Wafer-Level Packaging

Thermal Management

Chip Scale Module

Heat Spreader

Standoff Conductive Layer

Multi-Row Leads

Protective Coating

54 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12302657 - Semiconductor device and method of forming an optical semiconductor package with a shield structure (2025-05-13),

2. 12211863 - Reliable semiconductor packages (2025-01-28),

3. 9659897 - Integrated circuit packaging system with interposer structure and method of manufacture thereof (2017-05-23),

4. 9355983 - Integrated circuit packaging system with interposer structure and method of manufacture thereof (2016-05-31),

5. 9305809 - Integrated circuit packaging system with coreless substrate and method of manufacture thereof (2016-04-05),

6. 9293351 - Integrated circuit packaging system with planarity control and method of manufacture thereof (2016-03-22),

7. 9281300 - Chip scale module package in BGA semiconductor package (2016-03-08),

8. 9076737 - Integrated circuit packaging system with bumps and method of manufacture thereof (2015-07-07),

9. 9059151 - Integrated circuit packaging system with island terminals and embedded paddle and method of manufacture thereof (2015-06-16),

10. 9048228 - Integrated circuit packaging system with side solderable leads and method of manufacture thereof (2015-06-02),

11. 9035440 - Integrated circuit packaging system with a lead and method of manufacture thereof (2015-05-19),

12. 9006031 - Semiconductor device and method of forming EWLB package with standoff conductive layer over encapsulant bumps (2015-04-14),

13. 9000579 - Integrated circuit package system with bonding in via (2015-04-07),

14. 8993376 - Semiconductor device and method of forming wafer-level multi-row etched leadframe with base leads and embedded semiconductor die (2015-03-31),

15. 8936971 - Integrated circuit packaging system with die paddles and method of manufacture thereof (2015-01-20),

Title: The Innovative Journey of Emmanuel Espiritu

Introduction: Emmanuel Espiritu is a visionary inventor based in Singapore, SG, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Emmanuel Espiritu holds several patents in the areas of artificial intelligence, renewable energy, and sustainable technologies, showcasing his commitment to creating a more efficient and eco-friendly world.

Career Highlights: With a background in engineering and a passion for problem-solving, Emmanuel Espiritu has led numerous successful projects that have revolutionized industries and improved the quality of life for many.

Collaborations: Throughout his career, Emmanuel Espiritu has collaborated with leading research institutions, universities, and tech companies to bring his ideas to life and make a lasting impact on society.

Conclusion: Emmanuel Espiritu's dedication to innovation and his relentless pursuit of excellence continue to inspire the next generation of inventors and shape the future of technology.