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For the Inventor, By the Inventor

Singapore, Singapore

Emmanuel Espiritu

USPTO Granted Patents = 54 

Average Co-Inventor Count = 3.6

ph-index = 8

Forward Citations = 296(Granted Patents)

Forward Citations (Not Self Cited) = 286(Dec 10, 2025)


Inventors with similar research interests:


Company Filing History:

goldMedal52 out of 1,812 
 
Stats Chippac Pte. Ltd.
 patents
silverMedal2 out of 66 
 
Utac Headquarters Pte. Ltd.
 patents

Years Active: 2008-2025

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Areas of Expertise:
Semiconductor Device
Integrated Circuit Packaging
Optical Semiconductor Package
Chip Scale Module Package
Leadframe Interposer
Wafer-Level Packaging
Heat Spreader Stacking
Quad Flat Package
BGA Semiconductor Package
Multi-Row Leads
Embedded Semiconductor Die
Direct Via Wire Bonding
54 patents (USPTO):Explore Patents
1. 12302657 - Semiconductor device and method of forming an optical semiconductor package with a shield structure (2025-05-13),
2. 12211863 - Reliable semiconductor packages (2025-01-28),
3. 9659897 - Integrated circuit packaging system with interposer structure and method of manufacture thereof (2017-05-23),
4. 9355983 - Integrated circuit packaging system with interposer structure and method of manufacture thereof (2016-05-31),
5. 9305809 - Integrated circuit packaging system with coreless substrate and method of manufacture thereof (2016-04-05),
6. 9293351 - Integrated circuit packaging system with planarity control and method of manufacture thereof (2016-03-22),
7. 9281300 - Chip scale module package in BGA semiconductor package (2016-03-08),
8. 9076737 - Integrated circuit packaging system with bumps and method of manufacture thereof (2015-07-07),
9. 9059151 - Integrated circuit packaging system with island terminals and embedded paddle and method of manufacture thereof (2015-06-16),
10. 9048228 - Integrated circuit packaging system with side solderable leads and method of manufacture thereof (2015-06-02),
11. 9035440 - Integrated circuit packaging system with a lead and method of manufacture thereof (2015-05-19),
12. 9006031 - Semiconductor device and method of forming EWLB package with standoff conductive layer over encapsulant bumps (2015-04-14),
13. 9000579 - Integrated circuit package system with bonding in via (2015-04-07),
14. 8993376 - Semiconductor device and method of forming wafer-level multi-row etched leadframe with base leads and embedded semiconductor die (2015-03-31),
15. 8936971 - Integrated circuit packaging system with die paddles and method of manufacture thereof (2015-01-20),

Title: The Innovative Journey of Emmanuel Espiritu

Introduction: Emmanuel Espiritu is a visionary inventor based in Singapore, SG, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Emmanuel Espiritu holds several patents in the areas of artificial intelligence, renewable energy, and sustainable technologies, showcasing his commitment to creating a more efficient and eco-friendly world.

Career Highlights: With a background in engineering and a passion for problem-solving, Emmanuel Espiritu has led numerous successful projects that have revolutionized industries and improved the quality of life for many.

Collaborations: Throughout his career, Emmanuel Espiritu has collaborated with leading research institutions, universities, and tech companies to bring his ideas to life and make a lasting impact on society.

Conclusion: Emmanuel Espiritu's dedication to innovation and his relentless pursuit of excellence continue to inspire the next generation of inventors and shape the future of technology.

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