The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 07, 2015
Filed:
Mar. 30, 2007
Applicants:
IL Kwon Shim, Singapore, SG;
Dario S. Filoteo, Jr., Singapore, SG;
Emmanuel Espiritu, Singapore, SG;
Rachel Layda Abinan, Singapore, SG;
Inventors:
Il Kwon Shim, Singapore, SG;
Dario S. Filoteo, Jr., Singapore, SG;
Emmanuel Espiritu, Singapore, SG;
Rachel Layda Abinan, Singapore, SG;
Assignee:
STATS ChipPAC Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 21/44 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49827 (2013.01); H01L 24/48 (2013.01); H01L 24/78 (2013.01); H01L 24/85 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48228 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/48471 (2013.01); H01L 2224/48479 (2013.01); H01L 2224/4848 (2013.01); H01L 2224/49171 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/78301 (2013.01); H01L 2224/85186 (2013.01); H01L 2924/01014 (2013.01); H01L 2924/014 (2013.01); H01L 2924/14 (2013.01); H01L 2924/30105 (2013.01); H01L 2924/30107 (2013.01); H01L 24/49 (2013.01); H01L 2924/01033 (2013.01); H01L 2224/32225 (2013.01); H01L 2924/10253 (2013.01);
Abstract
An integrated circuit package system includes a substrate having an opening provided therein, forming a conductor in the opening having a closed end at the bottom, attaching an integrated circuit die over the substrate, and connecting a die interconnect to the integrated circuit die and the closed end of the conductor.