Singapore, Singapore

Rachel Layda Abinan


Average Co-Inventor Count = 4.4

ph-index = 6

Forward Citations = 110(Granted Patents)


Company Filing History:


Years Active: 2009-2016

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11 patents (USPTO):Explore Patents

Title: Rachel Layda Abinan: Innovator in Semiconductor Packaging

Introduction

Rachel Layda Abinan is a prominent inventor based in Singapore, known for her significant contributions to the field of semiconductor packaging. With a total of 11 patents to her name, she has made remarkable advancements in technology that enhance the efficiency and functionality of semiconductor devices.

Latest Patents

Among her latest patents is a groundbreaking design for a chip scale module package in a ball grid array (BGA) semiconductor package. This innovative package includes a BGA substrate with integrated metal layer circuitry, a flip chip chip scale module package (CSMP) featuring a first integrated passive device (IPD), and an application die attached to the IPD. The method of manufacturing this semiconductor package involves providing a BGA substrate with integrated metal layer circuitry, attaching a flip chip CSMP with a first IPD to the BGA substrate, and subsequently attaching an application die to the IPD. Another notable patent is for an integrated circuit package system with bonding in via, which includes a substrate with an opening, a conductor formed in the opening, and an integrated circuit die attached over the substrate.

Career Highlights

Rachel is currently employed at Stats Chippac Pte. Ltd., where she continues to push the boundaries of semiconductor technology. Her work has not only contributed to her personal success but has also advanced the capabilities of the company in the competitive tech industry.

Collaborations

Throughout her career, Rachel has collaborated with talented individuals such as Dario S Filoteo, Jr. and Emmanuel Espiritu. These partnerships have fostered innovation and creativity in her projects, leading to successful outcomes in her field.

Conclusion

Rachel Layda Abinan stands out as a leading inventor in semiconductor packaging, with her innovative patents and contributions to the industry. Her work continues to inspire advancements in technology and showcases the importance of female inventors in the field.

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