The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 27, 2011
Filed:
Mar. 10, 2006
Philip Lyndon Cablao, Singapore, SG;
Dario S. Filoteo, Jr., Singapore, SG;
Leo A. Merilo, Singapore, SG;
Emmanuel Espiritu, Singapore, SG;
Rachel Layda Abinan, Singapore, SG;
Allan Ilagan, Singapore, SG;
Philip Lyndon Cablao, Singapore, SG;
Dario S. Filoteo, Jr., Singapore, SG;
Leo A. Merilo, Singapore, SG;
Emmanuel Espiritu, Singapore, SG;
Rachel Layda Abinan, Singapore, SG;
Allan Ilagan, Singapore, SG;
STATS ChipPAC Ltd., Singapore, SG;
Abstract
A stacked integrated circuit package system is provided forming a first stack layer having a first integrated circuit die on a first substrate, forming a second stack layer having a second integrated circuit die on a second substrate, and mechanically and electrically connecting a spacer layer having a first passive component between the second stack layer and the first stack layer.