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Singapore, Singapore

Stats Chippac Pte. Ltd.

USPTO Granted Patents = 1,820

Trademarks = 3

Forward Citations = 15,315

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593 inventors (with patents filed for the assignee):

Yaojian Lin (285 out of 290 patents)

Byung Tai Do (223 out of 227 patents)

Zigmund Ramirez Camacho (214 out of 219 patents)

4. Seng Guan Chow (189 out of 207 patents)

5. Reza A Pagaila (186 out of 192 patents)

6. Il Kwon Shim (155 out of 202 patents)

7. Heap Hoe Kuan (143 out of 143 patents)

8. Linda Pei Ee Chua (125 out of 127 patents)

9. Kang Chen (116 out of 118 patents)

10. Lionel Chien Hui Tay (108 out of 110 patents)

11. Rajendra D Pendse (101 out of 144 patents)

12. Henry Descalzo Bathan (100 out of 101 patents)

13. Pandi Chelvam Marimuthu (99 out of 102 patents)

14. HeeJo Chi (83 out of 85 patents)

15. Rui Huang (82 out of 87 patents)

Core Competencies:

Semiconductor Devices

Embedded Wafer Level Chip Scale Packages

Electromagnetic Interference Shielding

Hybrid Substrates

Thermal Optimization

Graphene-Coated Core

Microelectromechanical Systems

Advanced Thermal Dissipation

Antenna-in-Package Devices

Electrical Circuit Patterns

Selective EMI Shielding

Double-Sided SiP Modules

1,820 patents: Sort by Forward Citations

1. 12525587 - Semiconductor device and method of forming vertical interconnect structure for pop module (2026-01-13),

2. 12525561 - Semiconductor device and method of forming dummy SOP within saw street (2026-01-13),

3. 12525557 - Die-beam alignment for laser-assisted bonding (2026-01-13),

4. 12525518 - Semiconductor device and method of forming double-sided rectifying antenna on power module (2026-01-13),

5. 12525478 - System and method of providing FOUP or cassette supporting structure for handling various size or shape wafers and panels (2026-01-13),

6. 12482755 - Semiconductor device and method of making an interconnect bridge with integrated passive devices (2025-11-25),

7. 12469819 - Semiconductor device and method of forming embedded wafer level chip scale packages (2025-11-11),

8. 12469796 - Method of forming an embedded magnetic shielding device (2025-11-11),

9. 12469791 - Semiconductor device and method of stacking hybrid substrates with embedded electric components (2025-11-11),

10. 12462084 - Power envelope analysis for the thermal optimization of multi-chip modules (2025-11-04),

11. 12456689 - Interconnect device and semiconductor assembly incorporating the same (2025-10-28),

12. 12444694 - Semiconductor device and method of forming selective EMI shielding with slotted substrate (2025-10-14),

13. 12444639 - Semiconductor device and method for reducing metal burrs using laser grooving (2025-10-14),

14. 12444620 - Semiconductor device and method of forming SiP module absent substrate (2025-10-14),

15. 12438099 - Semiconductor device and method of forming EMI shielding material in two-step process to avoid contaminating electrical connector (2025-10-07),

STATS ChipPAC Pte. Ltd. is a leading provider of advanced semiconductor packaging and test services. The company offers a comprehensive range of integrated circuit (IC) packaging, test and semiconductor technology solutions for a wide range of applications. With a global presence, STATS ChipPAC serves customers in various industries including communications, consumer electronics, computing, automotive, and more. Their state-of-the-art facilities and cutting-edge technologies enable them to deliver high-quality, cost-effective solutions to their customers worldwide.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Jan 20 2026

1,820 Patents

#2 in Singapore

#2 in Singapore

#543 in the World

Singapore, Singapore

Stats Chippac Pte. Ltd.

Forward Citations = 15,315

593 inventors:

Yaojian Lin (285 out of 290 patents)

Byung Tai Do (223 out of 227 patents)

Zigmund Ramirez Camacho (214 out of 219 patents)

4. Seng Guan Chow (189 out of 207 patents)

5. Reza A Pagaila (186 out of 192 patents)

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