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Singapore, Singapore

Stats Chippac Pte. Ltd.

USPTO Granted Patents = 1,842

% Expired Patents = 1.0

Trademarks = 3

Forward Citations = 15,770

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618 inventors (with patents filed for the assignee):

Yaojian Lin (285 out of 290 patents)

Byung Tai Do (223 out of 227 patents)

Zigmund Ramirez Camacho (215 out of 219 patents)

4. Seng Guan Chow (189 out of 207 patents)

5. Reza A Pagaila (186 out of 192 patents)

6. Il Kwon Shim (156 out of 208 patents)

7. Heap Hoe Kuan (143 out of 143 patents)

8. Linda Pei Ee Chua (126 out of 128 patents)

9. Kang Chen (116 out of 118 patents)

10. Lionel Chien Hui Tay (108 out of 110 patents)

11. Rajendra D Pendse (101 out of 145 patents)

12. Pandi Chelvam Marimuthu (101 out of 103 patents)

13. Henry Descalzo Bathan (101 out of 101 patents)

14. HeeJo Chi (83 out of 85 patents)

15. Rui Huang (82 out of 87 patents)

Core Competencies:

EMI Shielding

Graphene Integration

Thermal Management

System-in-Package

Wafer-Level Packages

Interconnects

Multi-Chip Modules

Vertical Structures

Hybrid Substrates

Passive Devices

Electrical Components

Laser-Based Techniques

1,842 patents: Sort by Forward Citations

1. 12727502 - Semiconductor device and method of using a standardized carrier to form embedded wafer level chip scale packages (2026-09-01),

2. 12721213 - Semiconductor device and method of forming channels in encapsulant to reduce warpage in reconstituted wafer (2026-08-25),

3. 12721185 - Semiconductor device and method of making face-up wafer-level package using intensive pulsed light irradiation (2026-08-25),

4. 12713951 - Semiconductor Device and Method of Making Redistribution Layers with Intensive Pulsed Light Irradiation (2026-08-18),

5. 12713931 - APPARATUS AND METHOD FOR SELECTIVELY FORMING A SHIELDING LAYER ON A SEMICONDUCTOR PACKAGE (2026-08-18),

6. 12708038 - Semiconductor device and method of die attach with adhesive layer containing graphene-coated core (2026-08-11),

7. 12707981 - Semiconductor device and method of forming shielding material containing conductive spheres (2026-08-11),

8. 12690316 - Method of making a semiconductor package with graphene for die attach (2026-07-21),

9. 12672542 - Semiconductor device and method of controlling distribution of liquid metal TIM using lid structure (2026-06-30),

10. 12652982 - Semiconductor manufacturing equipment and method of expelling residue through suction hood (2026-06-09),

11. 12642101 - Semiconductor device and method of forming high crystal quality magnetic layer for shielding of low frequency magnetic fields (2026-05-26),

12. 12635526 - Semiconductor device and method of making an EMI shield using intensive pulsed light irradiation (2026-05-19),

13. 12622277 - Semiconductor device and method of partial shielding with embedded graphene core shells (2026-05-05),

14. 12616048 - Semiconductor device and method of forming inverted EWLB package with vertical e-bar structure (2026-04-28),

15. 12610851 - Semiconductor device and method of making a dual-side molded system-in-package with fine-pitched interconnects (2026-04-21),

Stats Chippac Pte. Ltd., based in Singapore, specializes in semiconductor packaging solutions, focusing on advanced technologies that enhance device performance and reliability. The company is recognized for its expertise in EMI shielding, thermal management, and the integration of innovative materials like graphene. With a strong emphasis on System-in-Package (SiP) and wafer-level packaging, Stats Chippac develops multi-chip modules and vertical structures, catering to the evolving needs of the semiconductor industry.

Profile summary based on public USPTO records.

Company Badge

USPTO Data Jan 1 1976 - Sep 29 2026

Stats Chippac Pte. Ltd.

1,842 Patents

#2 in Singapore

#2 in Singapore

#547 in the World

Singapore, Singapore

Stats Chippac Pte. Ltd.

Forward Citations = 15,770

618 inventors:

Yaojian Lin (285 out of 290 patents)

Byung Tai Do (223 out of 227 patents)

Zigmund Ramirez Camacho (215 out of 219 patents)

4. Seng Guan Chow (189 out of 207 patents)

5. Reza A Pagaila (186 out of 192 patents)

Please report any incorrect information to [email protected]

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