For the Inventor, By the Inventor

Enter assignee name

Singapore, Singapore

Stats Chippac Pte. Ltd.

USPTO Granted Patents = 1,845

% Expired Patents = 1.0

Trademarks = 3

Forward Citations = 15,770

Loading Chart...

Loading Chart...

620 inventors (with patents filed for the assignee):

Yaojian Lin (285 out of 290 patents)

Byung Tai Do (223 out of 227 patents)

Zigmund Ramirez Camacho (215 out of 219 patents)

4. Seng Guan Chow (189 out of 207 patents)

5. Reza A Pagaila (186 out of 192 patents)

6. Il Kwon Shim (156 out of 208 patents)

7. Heap Hoe Kuan (143 out of 143 patents)

8. Linda Pei Ee Chua (128 out of 130 patents)

9. Kang Chen (116 out of 118 patents)

10. Lionel Chien Hui Tay (108 out of 110 patents)

11. Rajendra D Pendse (101 out of 145 patents)

12. Pandi Chelvam Marimuthu (101 out of 103 patents)

13. Henry Descalzo Bathan (101 out of 101 patents)

14. HeeJo Chi (83 out of 85 patents)

15. Rui Huang (82 out of 87 patents)

Core Competencies:

EMI Shielding

Graphene Integration

Thermal Management

System-in-Package

Wafer-Level Packages

Interconnects

Multi-Chip Modules

Vertical Structures

Hybrid Substrates

Passive Devices

Electrical Components

Laser-Based Techniques

1,845 patents: Sort by Forward Citations

1. 12765411 - Semiconductor device and method of forming encapsulated vertical interconnect structure (2026-10-13),

2. 12765404 - Semiconductor device and method of forming conductive vias to have enhanced contact to shielding layer (2026-10-13),

3. 12757798 - Semiconductor devices and methods of making semiconductor devices having embedded photonic bridge die (2026-10-06),

4. 12727502 - Semiconductor device and method of using a standardized carrier to form embedded wafer level chip scale packages (2026-09-01),

5. 12721213 - Semiconductor device and method of forming channels in encapsulant to reduce warpage in reconstituted wafer (2026-08-25),

6. 12721185 - Semiconductor device and method of making face-up wafer-level package using intensive pulsed light irradiation (2026-08-25),

7. 12713951 - Semiconductor Device and Method of Making Redistribution Layers with Intensive Pulsed Light Irradiation (2026-08-18),

8. 12713931 - APPARATUS AND METHOD FOR SELECTIVELY FORMING A SHIELDING LAYER ON A SEMICONDUCTOR PACKAGE (2026-08-18),

9. 12708038 - Semiconductor device and method of die attach with adhesive layer containing graphene-coated core (2026-08-11),

10. 12707981 - Semiconductor device and method of forming shielding material containing conductive spheres (2026-08-11),

11. 12690316 - Method of making a semiconductor package with graphene for die attach (2026-07-21),

12. 12672542 - Semiconductor device and method of controlling distribution of liquid metal TIM using lid structure (2026-06-30),

13. 12652982 - Semiconductor manufacturing equipment and method of expelling residue through suction hood (2026-06-09),

14. 12642101 - Semiconductor device and method of forming high crystal quality magnetic layer for shielding of low frequency magnetic fields (2026-05-26),

15. 12635526 - Semiconductor device and method of making an EMI shield using intensive pulsed light irradiation (2026-05-19),

Company Overview

Stats Chippac Pte. Ltd., based in Singapore, specializes in semiconductor packaging solutions, focusing on advanced technologies that enhance device performance and reliability. The company is recognized for its expertise in EMI shielding, thermal management, and the integration of innovative materials like graphene. With a strong emphasis on System-in-Package (SiP) and wafer-level packaging, Stats Chippac develops multi-chip modules and vertical structures, catering to the evolving needs of the semiconductor industry.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 20 2026

1,845 Patents

#2 in Singapore

#2 in Singapore

#548 in the World

Singapore, Singapore

Stats Chippac Pte. Ltd.

Forward Citations = 15,770

620 inventors:

Yaojian Lin (285 out of 290 patents)

Byung Tai Do (223 out of 227 patents)

Zigmund Ramirez Camacho (215 out of 219 patents)

4. Seng Guan Chow (189 out of 207 patents)

5. Reza A Pagaila (186 out of 192 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Stats Chippac Pte. Ltd.. Retrieved from https://idiyas.com/company/stats-chippac

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

Loading…