Semiconductor devices and methods of making semiconductor devices having embedded photonic bridge die

Abstract

A semiconductor device has a bridge die including a photonic circuit. An optical epoxy is deposited over the photonic circuit. The bridge die is disposed over a first interconnect structure. An encapsulant is deposited over the bridge die and first interconnect structure. A portion of the encapsulant is removed to expose the optical epoxy. A second interconnect structure is formed over the encapsulant with an opening in the second interconnect structure over the photonic circuit and optical epoxy. A first semiconductor die and second semiconductor die are disposed over the second interconnect structure. The first semiconductor die is electrically coupled to the second semiconductor die through the bridge die.