Linda Pei Ee Chua

Title: Linda Pei Ee Chua: Innovations in Semiconductor Devices

Introduction:

Linda Pei Ee Chua is a prolific inventor based in Singapore, SG, with an impressive portfolio of 122 patents. Her expertise lies in the field of semiconductor devices, and her contributions have significantly advanced the industry. Linda currently works at Stats Chippac Pte. Ltd., where she continues to push the boundaries of innovation in this space. In this article, we will delve into Linda Pei Ee Chua's latest patents, career highlights, and notable collaborations.

Latest Patents:

Linda Pei Ee Chua's recent patents showcase her deep understanding of semiconductor technologies and her ability to develop groundbreaking solutions. One notable patent is titled "Semiconductor Device and Method of Forming Fo-WLCSP with Recessed Interconnect Area in Peripheral Region of Semiconductor Die." This invention introduces a novel approach to forming recessed interconnect areas around a semiconductor die using a temporary layer and encapsulant. This method enables the integration of multiple steps and enhances the performance of the semiconductor device.

Another noteworthy patent is called "Semiconductor Device and Method of Forming Electromagnetic (EM) Shielding for LC Circuits." This invention focuses on providing protection against electromagnetic interference (EMI) and radiofrequency interference (RFI) in semiconductor devices. Linda's innovative shielding layer, electrically connected to an external low-impedance ground point, safeguards internal components from both internal and external inter-device interference, strengthening device reliability.

Career Highlights:

Linda Pei Ee Chua's career as an inventor in the semiconductor industry has been notable for her numerous contributions to the field. With a total of 122 patents to her name, Linda's work has significantly advanced semiconductor device technologies. Her expertise in forming recessed interconnect areas, as demonstrated in her patents, has revolutionized the integration processes and opened new doors for miniaturization.

Collaborations:

Throughout her career, Linda Pei Ee Chua has had the opportunity to collaborate with other industry professionals on various projects. Two notable collaborations include working with Byung Tai Do and Reza A Pagaila. Byung Tai Do brings his expertise in semiconductor packaging, and Reza A Pagaila contributes his knowledge in interconnect technologies. These collaborations have undoubtedly enriched Linda's work and contributed to the development of groundbreaking innovations.

Conclusion:

Linda Pei Ee Chua's contributions to the semiconductor industry through her numerous patents and impeccable career journey have solidified her position as a prominent figure in the field. Her innovative approach to forming recessed interconnect areas and developing electromagnetic shielding technologies has significantly enhanced the performance and reliability of semiconductor devices. Linda's collaboration with industry experts further demonstrates her dedication to pushing the boundaries of innovation. We can undoubtedly expect more remarkable inventions from Linda Pei Ee Chua as she continues to make significant strides in the world of semiconductor devices.