The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 07, 2018
Filed:
Mar. 15, 2013
Applicant:
Stats Chippac Pte. Ltd., Singapore, SG;
Inventors:
Assignee:
STATS ChipPAC Pte. Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/488 (2006.01);
U.S. Cl.
CPC ...
H01L 23/488 (2013.01); H01L 23/00 (2013.01);
Abstract
A method of manufacture of an integrated circuit packaging system includes providing an integrated circuit having an active side and a non-active side; forming an indent, having a flange and an indent side, from a peripheral region of the active side; and forming a conformal interconnect, having an elevated segment, a slope segment, and a flange segment, over the indent.