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For the Inventor, By the Inventor

Singapore, Singapore

Rui Huang

USPTO Granted Patents = 87 

Average Co-Inventor Count = 3.8

ph-index = 15

Forward Citations = 993(Granted Patents)

Forward Citations (Not Self Cited) = 973(Dec 10, 2025)


Inventors with similar research interests:


Company Filing History:

goldMedal82 out of 1,812 
 
Stats Chippac Pte. Ltd.
 patents
silverMedal5 out of 69 
 
Utac Headquarters Pte. Ltd.
 patents

Years Active: 2009-2019

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Areas of Expertise:
Semiconductor Packaging
Integrated Circuit Packaging
Vertical Interconnect Structure
Electrostatic Discharge Protection
Stacked Vias
Cavity Substrate
Encapsulation Connector
Warpage Control
Three-Dimensional Capacitors
No-Flow Underfill Material
Conductive Posts
Insulating Layer
87 patents (USPTO):Explore Patents
1. 10354934 - Semiconductor packages and methods of packaging semiconductor devices (2019-07-16),
2. 10170385 - Semiconductor device and method of forming stacked vias within interconnect structure for FO-WLCSP (2019-01-01),
3. 9978658 - Semiconductor packages and methods of packaging semiconductor devices (2018-05-22),
4. 9960130 - Reliable interconnect (2018-05-01),
5. 9666500 - Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief (2017-05-30),
6. 9620557 - Semiconductor device and method of forming EWLB semiconductor package with vertical interconnect structure and cavity region (2017-04-11),
7. 9564387 - Semiconductor package having routing traces therein (2017-02-07),
8. 9524955 - Semiconductor device and method of forming no-flow underfill material around vertical interconnect structure (2016-12-20),
9. 9515016 - Semiconductor package and method of forming z-direction conductive posts embedded in structurally protective encapsulant (2016-12-06),
10. 9508623 - Semiconductor packages and methods of packaging semiconductor devices (2016-11-29),
11. 9385009 - Semiconductor device and method of forming stacked vias within interconnect structure for Fo-WLCSP (2016-07-05),
12. 9293350 - Semiconductor package system with cavity substrate and manufacturing method therefor (2016-03-22),
13. 9275877 - Semiconductor device and method of forming semiconductor package using panel form carrier (2016-03-01),
14. 9257356 - Semiconductor device and method of forming an IPD beneath a semiconductor die with direct connection to external devices (2016-02-09),
15. 9252172 - Semiconductor device and method of forming EWLB semiconductor package with vertical interconnect structure and cavity region (2016-02-02),

Title: **Rui Huang: Innovator in Semiconductor Packaging**

Introduction

Rui Huang, based in Singapore, has made significant contributions to the field of semiconductor technology. With an impressive portfolio of 87 patents, he has demonstrated his commitment to innovation and advancement in this rapidly evolving sector. Huang's expertise in semiconductor packages and methods of packaging semiconductor devices showcases his ability to solve complex challenges faced by the industry.

Latest Patents

Among Rui Huang's most recent patents are groundbreaking methods for semiconductor packages. These patents detail processes that involve providing a wafer with multiple dies and external electrical contacts. The technique enhances the efficiency of separating the wafer into individual dies, which feature encapsulated components that enhance reliability and performance.

Another noteworthy patent focuses on the development of a semiconductor device capable of forming stacked vias within an interconnect structure for a Flip Chip Wafer-Level Chip Scale Package (FO-WLCSP). This innovative method includes steps such as forming insulating and conductive layers that ensure optimal electrical connectivity and device efficiency.

Career Highlights

Rui Huang has worked with notable companies in the semiconductor industry, including Stats Chippac Pte. Ltd. and Utac Headquarters Pte. Ltd. His roles at these organizations have allowed him to leverage his expertise in semiconductor technology, leading to numerous advancements and a robust patent portfolio.

Collaborations

Throughout his career, Huang has collaborated with talented professionals, including coworkers Seng Guan Chow and Heap Hoe Kuan. These partnerships have contributed to the innovative projects and patents Huang has developed, reflecting the importance of teamwork in driving technological advancements.

Conclusion

Rui Huang's contributions to semiconductor packaging and device technology position him as a leading innovator in his field. With 87 patents and a history of collaboration with esteemed companies and colleagues, Huang continues to push the boundaries of what is possible in the semiconductor industry. His ongoing work promises to result in further innovations that will impact the future of technology.

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