The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 01, 2018

Filed:

Feb. 06, 2015
Applicant:

United Test and Assembly Center Ltd., Singapore, SG;

Inventors:

Rui Huang, Singapore, SG;

Chun Hong Wo, Singapore, SG;

Antonio Jr. Bambalan DiMaano, Singapore, SG;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 24/05 (2013.01); H01L 24/03 (2013.01); H01L 24/48 (2013.01); H01L 23/3171 (2013.01); H01L 24/32 (2013.01); H01L 24/45 (2013.01); H01L 24/73 (2013.01); H01L 24/85 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/05017 (2013.01); H01L 2224/0519 (2013.01); H01L 2224/0529 (2013.01); H01L 2224/05124 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/05393 (2013.01); H01L 2224/05552 (2013.01); H01L 2224/05558 (2013.01); H01L 2224/05618 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/05655 (2013.01); H01L 2224/05664 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/45139 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/45164 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48453 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/48507 (2013.01); H01L 2224/73265 (2013.01);
Abstract

Devices and methods for forming a device are disclosed. The device includes a contact region disposed over a last interconnect level of the device. The device includes a final passivation layer having at least an opening which at least partially exposes a top surface of the contact region and a buffer layer disposed at least over a first exposed portion of the top surface of the contact region. When an electrically conductive interconnection couples to the contact region, the buffer layer absorbs a portion of a force exerted to form an interconnection between the electrically conductive interconnection and the contact region.


Find Patent Forward Citations

Huang, Rui. (2018). Reliable interconnect (U.S. Patent No. 9960130). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9960130

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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