Company Filing History:
4 out of 69 
3 out of 48 
Years Active: 2015-2019
Title: Antonio Jr Bambalan Dimaano: Innovator in Semiconductor Packaging
Introduction
Antonio Jr Bambalan Dimaano is a notable inventor based in Singapore, recognized for his contributions to the field of semiconductor packaging. With a total of seven patents to his name, he has made significant advancements in the methods and technologies used in packaging semiconductor devices.
Latest Patents
Dimaano's latest patents focus on semiconductor packages and methods of packaging semiconductor devices. One of his innovative methods involves providing a package substrate with first and second major surfaces, which includes a base substrate made of mold material and a series of interconnect structures. These structures feature via contacts that extend through the substrate. Additionally, he has developed a method for processing a wafer that includes separating it into individual dies, each equipped with external electrical contacts and encapsulated with a protective material.
Career Highlights
Throughout his career, Dimaano has worked with prominent companies in the semiconductor industry, including Utac Headquarters Pte. Ltd. and United Test and Assembly Center Limited. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking innovations in semiconductor technology.
Collaborations
Dimaano has collaborated with talented professionals in his field, including Rui Huang and Chun Hong Wo. These partnerships have fostered a creative environment that has led to the development of advanced semiconductor packaging solutions.
Conclusion
Antonio Jr Bambalan Dimaano stands out as a key figure in the semiconductor industry, with a strong portfolio of patents and a commitment to innovation. His work continues to influence the future of semiconductor packaging technology.