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Singapore, Singapore

United Test and Assembly Center Limited

USPTO Granted Patents = 48

% Expired Patents = 25.0

Trademarks = 1

Forward Citations = 391

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70 inventors (with patents filed for the assignee):

Chin Hock Toh (14 out of 19 patents)

Ravi Kanth Kolan (13 out of 14 patents)

Hien Boon Tan (11 out of 18 patents)

4. Anthony Yi Sheng Sun (10 out of 13 patents)

5. Hao Liu (8 out of 9 patents)

6. Chuen Khiang Wang (7 out of 11 patents)

7. Susanto Tanary (7 out of 7 patents)

8. Yi Sheng Anthony Sun (6 out of 7 patents)

9. Nathapong Suthiwongsunthorn (5 out of 37 patents)

10. Catherine Bee Liang Ng (5 out of 7 patents)

11. Danny Retuta (5 out of 6 patents)

12. Wang Chuen Khiang (5 out of 5 patents)

13. Kriangsak Sae Le (4 out of 10 patents)

14. Chun Hong Wo (4 out of 5 patents)

15. Kian Teng Eng (4 out of 18 patents)

Core Competencies:

Semiconductor Packages

Leadframe Technology

Flip-Chip Packaging

Thermal Management

Through Silicon Via

Die Stacking

Interposer

Microchip Packaging

Cavity Chip Package

Multi-Die IC Package

Enhanced Wire Bonding

Structural Members

48 patents: Sort by Forward Citations

1. 10403592 - Semiconductor packages and methods of packaging semiconductor devices (2019-09-03),

2. 9786625 - Semiconductor packages and methods of packaging semiconductor devices (2017-10-10),

3. 9281218 - Method of producing a semiconductor package (2016-03-08),

4. 9165878 - Semiconductor packages and methods of packaging semiconductor devices (2015-10-20),

5. 9142487 - Packaging structural member (2015-09-22),

6. 9136142 - Semiconductor packages and methods of packaging semiconductor devices (2015-09-15),

7. 9117808 - Semiconductor packages and methods of packaging semiconductor devices (2015-08-25),

8. 9087777 - Semiconductor packages and methods of packaging semiconductor devices (2015-07-21),

9. 9023690 - Leadframe area array packaging technology (2015-05-05),

10. 8916422 - Semiconductor packages and methods of packaging semiconductor devices (2014-12-23),

11. 8860079 - Semiconductor packages and methods of packaging semiconductor devices (2014-10-14),

12. 8829666 - Semiconductor packages and methods of packaging semiconductor devices (2014-09-09),

13. 8816482 - Flip-chip leadframe semiconductor package (2014-08-26),

14. 8772921 - Interposer for semiconductor package (2014-07-08),

15. 8741762 - Through silicon via dies and packages (2014-06-03),

Company Overview

United Test and Assembly Center Limited, headquartered in Singapore, specializes in advanced semiconductor packaging solutions. The company focuses on various technologies including leadframe technology, flip-chip packaging, and through silicon via, catering to the evolving demands of the semiconductor industry. With expertise in multi-die IC packages and thermal enhancement, UTAC is committed to delivering innovative interposer designs and copper interconnects, positioning itself as a key player in the global semiconductor landscape.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 20 2026

48 Patents

#63 in Singapore

#63 in Singapore

#14,561 in the World

Singapore, Singapore

United Test and Assembly Center Limited

Forward Citations = 391

70 inventors:

Chin Hock Toh (14 out of 19 patents)

Ravi Kanth Kolan (13 out of 14 patents)

Hien Boon Tan (11 out of 18 patents)

4. Anthony Yi Sheng Sun (10 out of 13 patents)

5. Hao Liu (8 out of 9 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: United Test and Assembly Center Limited. Retrieved from https://idiyas.com/company/united-test-and-assembly-center

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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