For the Inventor, By the Inventor

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Singapore, Singapore

United Test and Assembly Center Limited

USPTO Granted Patents = 48

Trademarks = 2

Forward Citations = 381

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70 inventors (with patents filed for the assignee):

Chin Hock Toh (14 out of 19 patents)

Ravi Kanth Kolan (13 out of 14 patents)

Hien Boon Tan (11 out of 18 patents)

4. Anthony Yi Sheng Sun (10 out of 13 patents)

5. Hao Liu (8 out of 9 patents)

6. Chuen Khiang Wang (7 out of 11 patents)

7. Susanto Tanary (7 out of 7 patents)

8. Yi Sheng Anthony Sun (6 out of 7 patents)

9. Nathapong Suthiwongsunthorn (5 out of 37 patents)

10. Catherine Bee Liang Ng (5 out of 7 patents)

11. Danny Retuta (5 out of 6 patents)

12. Wang Chuen Khiang (5 out of 5 patents)

13. Kriangsak Sae Le (4 out of 10 patents)

14. Chun Hong Wo (4 out of 5 patents)

15. Kian Teng Eng (4 out of 18 patents)

Core Competencies:

Semiconductor Packaging

Leadframe Technology

Flip-Chip Packaging

Through Silicon Via

Multi-Die IC Packages

Thermal Enhancement

Interposer Design

Copper Interconnects

Stacked Die Packages

Mold Design

SIM Card Packaging

High Density Chip Scale

48 patents: Sort by Forward Citations

1. 10403592 - Semiconductor packages and methods of packaging semiconductor devices (2019-09-03),

2. 9786625 - Semiconductor packages and methods of packaging semiconductor devices (2017-10-10),

3. 9281218 - Method of producing a semiconductor package (2016-03-08),

4. 9165878 - Semiconductor packages and methods of packaging semiconductor devices (2015-10-20),

5. 9142487 - Packaging structural member (2015-09-22),

6. 9136142 - Semiconductor packages and methods of packaging semiconductor devices (2015-09-15),

7. 9117808 - Semiconductor packages and methods of packaging semiconductor devices (2015-08-25),

8. 9087777 - Semiconductor packages and methods of packaging semiconductor devices (2015-07-21),

9. 9023690 - Leadframe area array packaging technology (2015-05-05),

10. 8916422 - Semiconductor packages and methods of packaging semiconductor devices (2014-12-23),

11. 8860079 - Semiconductor packages and methods of packaging semiconductor devices (2014-10-14),

12. 8829666 - Semiconductor packages and methods of packaging semiconductor devices (2014-09-09),

13. 8816482 - Flip-chip leadframe semiconductor package (2014-08-26),

14. 8772921 - Interposer for semiconductor package (2014-07-08),

15. 8741762 - Through silicon via dies and packages (2014-06-03),

United Test and Assembly Center Limited (UTAC) is a leading provider of semiconductor packaging and test services. With over 50 years of experience in the industry, UTAC offers a comprehensive range of solutions to address the various needs of its global clientele. Headquartered in Singapore, UTAC operates a network of advanced manufacturing facilities and sales offices across Asia, Europe, and the United States. The company's commitment to innovation, quality, and customer satisfaction has made it a trusted partner for businesses in the semiconductor industry.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 30 2025

48 Patents

#56 in Singapore

#56 in Singapore

#14,123 in the World

Singapore, Singapore

United Test and Assembly Center Limited

Forward Citations = 381

70 inventors:

Chin Hock Toh (14 out of 19 patents)

Ravi Kanth Kolan (13 out of 14 patents)

Hien Boon Tan (11 out of 18 patents)

4. Anthony Yi Sheng Sun (10 out of 13 patents)

5. Hao Liu (8 out of 9 patents)

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