Danny Retuta

Title: Innovations by Danny Retuta

Introduction

Danny Retuta is a notable inventor based in Singapore, known for his contributions to semiconductor technology. He holds a total of six patents, showcasing his expertise and innovative spirit in the field. His work has significantly impacted the manufacturing processes of semiconductor packages.

Latest Patents

One of Danny Retuta's latest patents is a method of producing a semiconductor package. This method involves manufacturing a lead frame by providing an electrically conductive layer with a plurality of holes on its top surface. These holes form a structure of leads and a die pad on the conductive layer. The holes are filled with a non-conductive material, followed by the attachment of an electrically conductive foil on the top surface. The foil is then etched to create a network of leads, die pad, bus lines, dam bars, and tie lines, establishing connections between the components.

Career Highlights

Throughout his career, Danny has worked with prominent companies in the semiconductor industry, including United Test and Assembly Center Limited and Utac Headquarters Pte. Ltd. His experience in these organizations has allowed him to refine his skills and contribute to significant advancements in semiconductor manufacturing.

Collaborations

Danny has collaborated with talented individuals such as Hien Boon Tan and Anthony Yi Sheng Sun. These partnerships have fostered innovation and creativity in their projects.

Conclusion

Danny Retuta's contributions to semiconductor technology through his patents and collaborations highlight his role as a leading inventor in Singapore. His innovative methods continue to influence the industry and pave the way for future advancements.