The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 04, 2011
Filed:
Apr. 24, 2008
Roel Robles, Singapore, SG;
Danny Retuta, Tustin, CA (US);
Mary Annie Cheong, Singapore, SG;
Hien Boon Tan, Singapore, SG;
Anthony Yi Sheng Sun, Singapore, SG;
Richard Gan, Singapore, SG;
Roel Robles, Singapore, SG;
Danny Retuta, Tustin, CA (US);
Mary Annie Cheong, Singapore, SG;
Hien Boon Tan, Singapore, SG;
Anthony Yi Sheng Sun, Singapore, SG;
Richard Gan, Singapore, SG;
United Test And Assembly Center Ltd., Singapore, SG;
Abstract
A semiconductor package with a semiconductor chip having under bump metallizations (UBMs) on a first surface and a substrate having open vias. The substrate is attached to the semiconductor chip with the UBMs in alignment with the open vias. An encapsulant surrounds the semiconductor chip and the substrate and a conductor fills the open vias to form external package connections.