Richard Te Gan

Title: Richard Te Gan: Innovator in Semiconductor Packaging

Introduction

Richard Te Gan is a prominent inventor based in Singapore, known for his contributions to the field of semiconductor packaging. With a total of 5 patents to his name, he has made significant advancements in the methods and devices used in this critical area of technology.

Latest Patents

One of Richard's latest patents focuses on semiconductor packages and methods of packaging semiconductor devices. This innovative device includes a carrier substrate with first and second major surfaces. The first surface features a die region and contact pads, while the second surface contains package contacts. The carrier substrate is designed with a patterned lead frame that defines a line level with conductive traces and a via level with via contacts. This patterned lead frame facilitates interconnections between the contact pads and package contacts. Additionally, the carrier substrate incorporates a dielectric layer that isolates the conductive traces and via contacts. A die is mounted on the die region of the first surface, showcasing Richard's expertise in semiconductor technology.

Career Highlights

Throughout his career, Richard has worked with notable companies such as United Test and Assembly Center Limited and Utac Headquarters Pte. Ltd. His experience in these organizations has allowed him to refine his skills and contribute to the advancement of semiconductor packaging technologies.

Collaborations

Richard has collaborated with talented individuals in the industry, including Chuen Khiang Wang and Nathapong Suthiwongsunthorn. These collaborations have further enriched his work and led to innovative solutions in semiconductor packaging.

Conclusion

Richard Te Gan is a distinguished inventor whose work in semiconductor packaging has made a lasting impact on the industry. His innovative patents and collaborations reflect his commitment to advancing technology in this vital field.