The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 06, 2014

Filed:

Jul. 01, 2011
Applicants:

Chuen Khiang Wang, Singapore, SG;

Nathapong Suthiwongsunthorn, Singapore, SG;

Kriangsak Sae Le, Johor Bahru, MY;

Antonio Jr B Dimaano, Singapore, SG;

Catherine Bee Liang NG, Singapore, SG;

Richard Te Gan, Singapore, SG;

Kian Teng Eng, Singapore, SG;

Inventors:

Chuen Khiang Wang, Singapore, SG;

Nathapong Suthiwongsunthorn, Singapore, SG;

Kriangsak Sae Le, Johor Bahru, MY;

Antonio Jr B Dimaano, Singapore, SG;

Catherine Bee Liang Ng, Singapore, SG;

Richard Te Gan, Singapore, SG;

Kian Teng Eng, Singapore, SG;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/528 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
Abstract

A device is disclosed. The device includes a carrier substrate having first and second major surfaces. The first surface includes a die region and contact pads and the second surface includes package contacts. The carrier substrate includes a patterned lead frame which defines a line level with conductive traces and a via level with via contacts. The patterned lead frame provides interconnections between the contact pads and package contacts. The carrier substrate further includes a dielectric layer isolating the conductive traces and via contacts. The device includes a die mounted on the die region of the first surface.


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