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For the Inventor, By the Inventor

Singapore, Singapore

Kian Teng Eng

This inventor holds 18 USPTO granted patents and 1 published patent application. Top assignees: Texas Instruments Corporation, United Test and Assembly Center Limited, Utac Headquarters Pte. Ltd.. Active years: 1998-2018.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kian Teng Eng. Retrieved from https://idiyas.com/inventor/kian-teng-eng

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 18 

% Patents Active = 94.4

Average Co-Inventor Count = 3.8

ph-index = 11

Forward Citations = 492(Granted Patents)


Location History:

  • Compass Heights, SG (2012)
  • Singapore, SG (1998 - 2018)

Company Filing History:

goldMedal12 out of 29,869 
 
Texas Instruments Corporation
 patents
silverMedal4 out of 48 
 
United Test and Assembly Center Limited
 patents
bronzeMedal2 out of 78 
 
Utac Headquarters Pte. Ltd.
 patents
4. 1 out of 555 
 
Qimonda Ag
 patents
where one patent can have more than one assignee

Years Active: 1998-2018

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18 patents (USPTO):Explore Patents
1. 9881863 - Semiconductor packages and methods of packaging semiconductor devices (2018-01-30),
2. 9589875 - Semiconductor packages and methods of packaging semiconductor devices (2017-03-07),
3. 9136142 - Semiconductor packages and methods of packaging semiconductor devices (2015-09-15),
4. 8716873 - Semiconductor packages and methods of packaging semiconductor devices (2014-05-06),
5. 8592258 - Semiconductor package and method of attaching semiconductor dies to substrates (2013-11-26),
6. 8247272 - Copper on organic solderability preservative (OSP) interconnect and enhanced wire bonding process (2012-08-21),
7. 6514845 - Solder ball contact and method (2003-02-04),
8. 6420782 - Vertical ball grid array integrated circuit package (2002-07-16),
9. 6387729 - Method for adhering and sealing a silicon chip in an integrated circuit package (2002-05-14),
10. 6365833 - Integrated circuit package (2002-04-02),
11. 6320126 - Vertical ball grid array integrated circuit package (2001-11-20),
12. 6177723 - Integrated circuit package and flat plate molding process for integrated circuit package (2001-01-23),
13. 6087203 - Method for adhering and sealing a silicon chip in an integrated circuit (2000-07-11),
14. 6084306 - Bridging method of interconnects for integrated circuit packages (2000-07-04),
15. 5998860 - Double sided single inline memory module (1999-12-07),

Title: The Innovative Mind of Kian Teng Eng

Introduction

Kian Teng Eng is a prominent inventor based in Singapore, known for his significant contributions to the field of semiconductor technology. With a remarkable portfolio of 18 patents, he has made a lasting impact on the industry through his innovative designs and methods.

Latest Patents

One of Kian Teng Eng's latest patents focuses on semiconductor packages and methods of packaging semiconductor devices. This device features a carrier substrate with first and second major surfaces. The first surface includes a die region and contact pads, while the second surface contains package contacts. The carrier substrate is designed with a patterned lead frame that defines a line level with conductive traces and a via level with via contacts. This innovative lead frame facilitates interconnections between the contact pads and package contacts. Additionally, the carrier substrate incorporates a dielectric layer that isolates the conductive traces and via contacts. The device also includes a die mounted on the die region of the first surface, showcasing Kian's expertise in semiconductor packaging.

Career Highlights

Throughout his career, Kian Teng Eng has worked with notable companies such as Texas Instruments Corporation and United Test and Assembly Center Limited. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking advancements in semiconductor technology.

Collaborations

Kian has collaborated with talented individuals in the industry, including Jing Sua Goh and Min Yu Chan. These partnerships have foster

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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