Singapore, Singapore

Kian Teng Eng

USPTO Granted Patents = 18 

Average Co-Inventor Count = 3.8

ph-index = 11

Forward Citations = 491(Granted Patents)


Location History:

  • Compass Heights, SG (2012)
  • Singapore, SG (1998 - 2018)

Company Filing History:


Years Active: 1998-2018

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18 patents (USPTO):Explore Patents

Title: The Innovative Mind of Kian Teng Eng

Introduction

Kian Teng Eng is a prominent inventor based in Singapore, known for his significant contributions to the field of semiconductor technology. With a remarkable portfolio of 18 patents, he has made a lasting impact on the industry through his innovative designs and methods.

Latest Patents

One of Kian Teng Eng's latest patents focuses on semiconductor packages and methods of packaging semiconductor devices. This device features a carrier substrate with first and second major surfaces. The first surface includes a die region and contact pads, while the second surface contains package contacts. The carrier substrate is designed with a patterned lead frame that defines a line level with conductive traces and a via level with via contacts. This innovative lead frame facilitates interconnections between the contact pads and package contacts. Additionally, the carrier substrate incorporates a dielectric layer that isolates the conductive traces and via contacts. The device also includes a die mounted on the die region of the first surface, showcasing Kian's expertise in semiconductor packaging.

Career Highlights

Throughout his career, Kian Teng Eng has worked with notable companies such as Texas Instruments Corporation and United Test and Assembly Center Limited. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking advancements in semiconductor technology.

Collaborations

Kian has collaborated with talented individuals in the industry, including Jing Sua Goh and Min Yu Chan. These partnerships have foster

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