The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 07, 1999

Filed:

Dec. 19, 1997
Applicant:
Inventors:

Boon Pew Chan, Singapore, SG;

Kian Teng Eng, Singapore, SG;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; H01L / ;
U.S. Cl.
CPC ...
257679 ; 257723 ; 257680 ; 257202 ; 257668 ; 257693 ; 257738 ; 257737 ; 257673 ;
Abstract

A double sided single inline memory module (20) comprising a substrate (70) having a plurality of openings (86) and first and second surfaces (92, 94), a plurality of pads (82) being integral with the substrate (70) and extending into the opening (86), a plurality of chips (50) adhered to the substrate (70) having bonding pads (120), wire bonding (80) electrically connecting at least one of the bonding pads (120) to at least one of the pads (82) and potting material (90) encapsulating the wire bonding (80) and filling the opening (86) is disclosed.


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