Company Filing History:
Years Active: 1999-2002
Title: The Innovations of Boon Pew Chan in Integrated Circuit Technology
Introduction
Boon Pew Chan is a noted inventor based in Singapore, renowned for his significant contributions to the field of integrated circuit technology. With a total of seven patents to his name, Chan has been at the forefront of innovation in electronic device fabrication, working to enhance the efficiency and functionality of integrated circuits.
Latest Patents
Among his latest patents, Chan has developed a groundbreaking method for fabricating thin integrated circuit units. This invention describes a high-density unit that includes a unique first integrated circuit package with a carrier featuring both first and second sides. The silicon chip is affixed using an adhesive layer, with solder bonding employed to establish electrical connections to the carrier. This design allows for stackable and electrically connected integration with a second circuit package.
Another significant patent focuses on a novel method for adhering and sealing a silicon chip within an integrated circuit package. This innovative apparatus involves a substrate with an opening, together with a plurality of routing strips that extend into the opening. The routing strips are intricately connected to multiple pads on both surfaces of the substrate. The wire bonding technique used to connect the bonding pads to the routing strips ensures effective communication within the circuit, while the silicon chip is securely attached to the printed circuit board with an adhesive material that seals the connection.
Career Highlights
Boon Pew Chan's professional journey has been largely associated with Texas Instruments Corporation, a leader in the semiconductor industry. His work has contributed significantly to advancing the capabilities of integrated circuits, proving essential in a rapidly evolving technological landscape.
Collaborations
Throughout his career, Chan has collaborated with notable coworkers, including Min Yu Chan and Kian Teng Eng, enhancing the innovative efforts at Texas Instruments Corporation through their collective expertise. These collaborations have fostered an environment of shared knowledge, leading to the development of groundbreaking solutions in the realm of integrated circuitry.
Conclusion
Boon Pew Chan stands as a pivotal figure in the advancement of integrated circuit technology. With his pioneering patents and collaborations at Texas Instruments Corporation, he continues to influence the field, pushing the boundaries of what is possible in electronic design and fabrication. His innovative spirit is a testament to the importance of inventors in shaping the future of technology.