The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 22, 2002
Filed:
Mar. 16, 2001
Applicant:
Inventors:
Chew Weng Leong, Singapore, SG;
Chee Kiang Yew, Singapore, SG;
Min Yu Chan, Singapore, SG;
Pang Hup Ong, Singapore, SG;
Jeffrey Tuck Fook Toh, Singapore, SG;
Boon Pew Chan, Singapore, SG;
Assignee:
Texas Instruments Incorporated, Dallas, TX (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/144 ;
U.S. Cl.
CPC ...
H01L 2/144 ;
Abstract
A high density unit ( ) comprising a first integrated circuit package ( ) comprising a carrier ( ) having first and second sides ( ), a silicon chip ( ) attached by an adhesive layer ( ) and solder bonding ( ) electrically connecting the silicon chip ( ) to the carrier ( ) stackably and electrically connected to a second integrated circuit package ( ), is disclosed.