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Singapore, Singapore

Pang Hup Ong

USPTO Granted Patents = 7

Average Co-Inventor Count = 5.2

ph-index = 4

Forward Citations = 122(Granted Patents)

Company Filing History:

5 out of 29,297

Texas Instruments Corporation

United Test and Assembly Center Limited

where one patent can have more than one assignee

Years Active: 2000-2013

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7 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 8592258 - Semiconductor package and method of attaching semiconductor dies to substrates (2013-11-26),

2. 8247272 - Copper on organic solderability preservative (OSP) interconnect and enhanced wire bonding process (2012-08-21),

3. 6768646 - High density internal ball grid array integrated circuit package (2004-07-27),

4. 6468831 - Method of fabricating thin integrated circuit units (2002-10-22),

5. 6274929 - Stacked double sided integrated circuit package (2001-08-14),

6. 6091140 - Thin chip-size integrated circuit package (2000-07-18),

7. 6049129 - Chip size integrated circuit package (2000-04-11),

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