This inventor holds 7 USPTO granted patents. Top assignees: Texas Instruments Corporation, United Test and Assembly Center Limited, Qimonda Ag. Active years: 2000-2013.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
5 out of 29,888 
2 out of 48 
1 out of 555 
Years Active: 2000-2013
Title: The Innovative Contributions of Pang Hup Ong
Introduction
Pang Hup Ong is a notable inventor based in Singapore, SG. He has made significant contributions to the field of semiconductor technology, holding a total of 7 patents. His work focuses on improving methods for semiconductor packaging and attachment processes.
Latest Patents
One of his latest patents is a method for attaching semiconductor dies to substrates. This innovative approach involves placing a die on a solder mask and mounting it to the substrate by applying pressure and heat. The applied pressure ranges from approximately 5 to 10 kgf, while the heat is maintained at a temperature between 150 to 200°C. The pressure is applied for a duration of approximately 1 to 10 seconds. Another significant patent involves a semiconductor package that includes a substrate and a die attached to it. This package features a first contact region on the substrate and a second contact region on the die, with the first region comprising copper coated with an organic solderability preservative (OSP) material. The wire bonding process includes forming a ball bump on the first contact region, which is then electrically coupled to the second contact region.
Career Highlights
Throughout his career, Pang Hup Ong has worked with prominent companies in the semiconductor industry. Notably, he has been associated with Texas Instruments Corporation and United Test and Assembly Center Limited. His experience in these organizations has contributed to his expertise in semiconductor technologies.
Collaborations
Pang Hup Ong has collaborated with several professionals in his field, including Chee Kiang Yew and Min Yu Chan. These collaborations have further enhanced his innovative capabilities and contributions to semiconductor technology.
Conclusion
Pang Hup Ong's work in semiconductor packaging and attachment methods showcases his innovative spirit and technical expertise. His contributions have significantly impacted the semiconductor industry, and his patents reflect his commitment to advancing technology.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile