The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 11, 2000
Filed:
Dec. 19, 1997
Chee Kiang Yew, Singapore, SG;
Yong Khim Swee, Singapore, SG;
Min Yu Chan, Singapore, SG;
Pang Hup Ong, Singapore, SG;
Anthony Coyle, Plano, TX (US);
Texas Instruments Incorporated, Dallas, TX (US);
Abstract
An integrated circuit package (30) comprising a substrate (70) having an opening (86) and first and second surfaces (92, 94), a plurality of routing strips (82) being integral with the substrate (70) and extending to opening (86), a plurality of pads (100) disposed on the first surface (92) and electrically connected with at least one of the routing strips (82), a chip (50) having bonding pads (120) is adhered to the second surface (84) of the substrate (70) and is of substantially the same outline as substrate (70), wire bonding (80) electrically connecting at least one bonding pad (120) to at least one of the routing strips (82) and potting material (90) filling the opening (86) is disclosed.