IDiyas

For the Inventor, By the Inventor

Singapore, Singapore

Chee Kiang Yew

USPTO Granted Patents = 15

Average Co-Inventor Count = 3.8

ph-index = 12

Forward Citations = 411(Granted Patents)


Company Filing History:

goldMedal14 out of 29,232 
 
Texas Instruments Corporation
 patents
silverMedal1 out of 2 
 
Flex-p Industries Sdn Bhd.
 patents

Years Active: 1999-2006

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15 patents (USPTO):
1. 7089661 - Method for packaging small size memory cards (2006-08-15),
2. 7042070 - Direct attachment of semiconductor chip to organic substrate (2006-05-09),
3. 6768646 - High density internal ball grid array integrated circuit package (2004-07-27),
4. 6602803 - Direct attachment semiconductor chip to organic substrate (2003-08-05),
5. 6468831 - Method of fabricating thin integrated circuit units (2002-10-22),
6. 6387729 - Method for adhering and sealing a silicon chip in an integrated circuit package (2002-05-14),
7. 6365833 - Integrated circuit package (2002-04-02),
8. 6278616 - Modifying memory device organization in high density packages (2001-08-21),
9. 6274929 - Stacked double sided integrated circuit package (2001-08-14),
10. 6218202 - Semiconductor device testing and burn-in methodology (2001-04-17),
11. 6091140 - Thin chip-size integrated circuit package (2000-07-18),
12. 6087203 - Method for adhering and sealing a silicon chip in an integrated circuit (2000-07-11),
13. 6084306 - Bridging method of interconnects for integrated circuit packages (2000-07-04),
14. 6049129 - Chip size integrated circuit package (2000-04-11),
15. 5956233 - High density single inline memory module (1999-09-21),

Title: **Inventor Spotlight: Chee Kiang Yew**

Introduction

Chee Kiang Yew is a prolific inventor based in Singapore, known for his contributions to memory card technology and innovative methods of integrating semiconductor chips with substrates. With a remarkable portfolio that includes 15 patents, his work exemplifies the intersection of electronic engineering and innovative design.

Latest Patents

Among Chee Kiang Yew's latest inventions is a pioneering method for packaging small-sized memory cards. This innovative method addresses the encapsulation of various memory cards, including xD Picture cards, Memory Stick™, Secure Digital™ (SD) cards, SmartMedia™, Multimedia cards (MMC), CompactFlash™, and PC cards. It involves moulding techniques that encapsulate a populated printed circuit board (PCB) to conform to standard external dimensions, ensuring the functionality of these memory devices. Additionally, he holds a patent for a method of directly attaching semiconductor chips to organic substrates. This method enhances adhesion by activating a protective polymer layer on the chip, ensuring a strong connection with the insulating substrate.

Career Highlights

Throughout his career, Chee Kiang Yew has made significant contributions while working for notable companies such as Texas Instruments Corporation and Flex-P Industries Sdn Bhd. His experiences at these organizations have played a crucial role in shaping his inventive approaches and technical expertise.

Collaborations

Chee Kiang Yew has collaborated with talented individuals, including colleagues Min Yu Chan and Kian Teng Eng. These collaborations have fostered an environment of innovation, allowing for the sharing of ideas and enhancing the development of their projects.

Conclusion

Chee Kiang Yew's contributions to the field of electronics and memory technology are noteworthy. With 15 patents to his name, his innovative methods continue to influence the way memory cards are packaged and how integrated circuits are manufactured. As technology evolves, Yew's inventions are poised to play a vital role in the future of electronic devices.

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