The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 17, 2001

Filed:

Oct. 06, 1998
Applicant:
Inventors:

Chee Kiang Yew, Singapore, SG;

Kim Hoch Tey, Singapore, SG;

Min Yu Chan, Singapore, SG;

Jeffrey Tuck Fock Toh, Singapore, SG;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/166 ; G01R 3/126 ;
U.S. Cl.
CPC ...
H01L 2/166 ; G01R 3/126 ;
Abstract

A packaged semiconductor device and a method for burn-in and testing are disclosed. The package comprises a carrier having a pattern of contact pads for electrical connection, and also a pattern of testing pads for electrical characterization such that their location, size and composition allows a conversion to contact pads after the device has been electrically characterized following burn-in. Furthermore, an adapter and a method for burn-in and testing are disclosed for use in testing a variety of different semiconductor devices. The adapter comprises a carrier having a pattern of testing pads bordering the carrier outline, and routing strips which are structured such that the carrier is adaptable to the package of the device being tested.


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