The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 15, 2006
Filed:
Apr. 11, 2003
Piau Fong, Gelugor, MY;
Chee Kiang Yew, Singapore, SG;
Colin Chun Sing Lum, Singapore, SG;
Matthew Keng Siew Chua, Bayan Baru, MY;
Piau Fong, Gelugor, MY;
Chee Kiang Yew, Singapore, SG;
Colin Chun Sing Lum, Singapore, SG;
Matthew Keng Siew Chua, Bayan Baru, MY;
Abstract
A method is disclosed for packaging a small size memory card, including xD Picture card, Memory Stick™, Secure Digital™ (SD) card, SmartMedia™ (SM) card, Multimedia card (MMC), CompactFlash™ (CF) card and PC card, by moulding over to encapsulate a populated printed circuit board (PCB) () to form the standard external dimensions and features of the memory card. The method comprises holding the populated PCB () in place in a cavity () of at least one mould piece; and moulding over both sides of the populated printed circuit board () to encapsulate said board. Various embodiments are disclosed, including means for holding the populated PCB () in the moulding cavity () for the encapsulation process, which includes transfer moulding and injection moulding processes, one or more moulding steps, and moulding over one part of one side of said board before the other side, and/or simultaneously moulding over both sides of said board.