Colin Chun Sing Lum

Title: Colin Chun Sing Lum: Innovator in Semiconductor Packaging

Introduction

Colin Chun Sing Lum is a notable inventor based in Singapore, recognized for his contributions to the field of semiconductor packaging. With a total of 2 patents, Lum has developed innovative methods that enhance the efficiency and effectiveness of memory card packaging and flip chip semiconductor packages.

Latest Patents

One of Lum's latest patents is a method for packaging small size memory cards. This method involves encapsulating a populated printed circuit board (PCB) to form the standard external dimensions and features of various memory cards, including xD Picture cards, Memory Stick™, Secure Digital™ (SD) cards, SmartMedia™ (SM) cards, Multimedia cards (MMC), CompactFlash™ (CF) cards, and PC cards. The process includes holding the populated PCB in place within a mould cavity and moulding over both sides of the PCB to encapsulate it. Various embodiments of this method are disclosed, including techniques for holding the PCB during the encapsulation process.

Another significant patent by Lum is related to producing a flip chip package. In this no-flow underfill process, a substrate is heated to an elevated temperature before dispensing underfill. This allows the underfill to flow more readily over mask portions and conductors on the substrate, filling spaces and preventing air from being trapped. The result is a flip chip semiconductor package with a lower void density, enhancing its reliability and performance.

Career Highlights

Colin Chun Sing Lum has worked with several companies, including Flex-P Industries Sdn Bhd and Advanpack Solutions Pte Ltd. His experience in these organizations has contributed to his expertise in semiconductor packaging technologies.

Collaborations

Throughout his career, Lum has collaborated with notable coworkers such as Piau Fong and Chee Kiang Yew. These collaborations have likely fostered innovation and development in his projects.

Conclusion

Colin Chun Sing Lum is a distinguished inventor whose work in semiconductor packaging has led to significant advancements in the industry. His innovative methods for memory card packaging and flip chip packages demonstrate his commitment to enhancing technology.