The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 02, 2002
Filed:
Mar. 22, 2001
Applicant:
Inventors:
Tie Wang, Singapore, SG;
Colin Chun Sing Lum, Singapore, SG;
Assignee:
Advanpack Solutions PTE LTD, Singapore, SG;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/144 ; H01L 2/148 ; H01L 2/150 ;
U.S. Cl.
CPC ...
H01L 2/144 ; H01L 2/148 ; H01L 2/150 ;
Abstract
In a no-flow underfill process , a substrate is heated to an elevated temperature prior to dispensing underfill thereon. The underfill flows more readily over mask portions and conductors on the substrate , filling in spaces between the conductors and the masking portions , thereby preventing air from being trapped thereabout. In addition, when a bumped die is heated during placement on the substrate with the underfill therebetween, the underfill flows around bumps more readily thereby preventing air from being trapped thereabout. The result is a flip chip semiconductor package having a lower void density.