For the Inventor, By the Inventor

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Singapore, Singapore

Advanpack Solutions Pte Ltd.

USPTO Granted Patents = 44

Forward Citations = 1,315

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45 inventors (with patents filed for the assignee):

Hwee-Seng Jimmy Chew (18 out of 18 patents)

Shoa-Siong Lim (14 out of 14 patents)

Kian-Hock Lim (8 out of 8 patents)

4. Chee Kian Ong (6 out of 7 patents)

5. Shoa Siong Lim (5 out of 6 patents)

6. Tan Kim Hwee (5 out of 5 patents)

7. Oviso Dominador Jr Fortaleza (4 out of 4 patents)

8. Kee Kwang Lau (4 out of 4 patents)

9. Roman Perez (4 out of 4 patents)

10. Alex Chew (3 out of 3 patents)

11. Tie Wang (3 out of 4 patents)

12. Antonio Dimaano (3 out of 3 patents)

13. Jimmy Hwee-Seng Chew (2 out of 2 patents)

14. Bin Chichik Abd Razak (2 out of 2 patents)

15. Ong Chee Kian (2 out of 2 patents)

Core Competencies:

Semiconductor Packaging

Multi-Layer Substrate

Fine Pitch Packaging

Chip Grid Array

Wafer Level Chip Scale Package

Pillar Bump Technology

Embedded Interconnection Layers

Etch-Back Type Package

Die Pillar Structures

Manufacturing Methods

Semiconductor Device Carrier

Package Miniaturization

44 patents: Sort by Forward Citations

1. 10763133 - Semiconductor structure and semiconductor package device using the same (2020-09-01),

2. 10446457 - Multi-layer substrate for semiconductor packaging (2019-10-15),

3. 10154588 - Manufacturing method of semiconductor package (2018-12-11),

4. 10109503 - Method of manufacturing semiconductor package device (2018-10-23),

5. 10049950 - Multi-layer substrate for semiconductor packaging (2018-08-14),

6. 9892916 - Manufacturing method of package substrate and package manufacturing method of semiconductor device (2018-02-13),

7. 9847268 - Semiconductor package and manufacturing method thereof (2017-12-19),

8. 9754899 - Semiconductor structure and method of fabricating the same (2017-09-05),

9. 9723717 - Substrate structure, semiconductor package device, and manufacturing method of semiconductor package (2017-08-01),

10. 9653323 - Manufacturing method of substrate structure having embedded interconnection layers (2017-05-16),

11. 9583449 - Semiconductor package (2017-02-28),

12. 9396982 - Semiconductor device carrier for fine pitch packaging miniaturization and manufacturing method thereof (2016-07-19),

13. 9379044 - Package carrier, package carrier manufacturing method, package structure for semiconductor device and manufacturing method thereof (2016-06-28),

14. 9362206 - Chip and manufacturing method thereof (2016-06-07),

15. 9305868 - Manufacturing method of forming an etch-back type semiconductor package with locking anchorages (2016-04-05),

Advantpack Solutions Pte Ltd is a leading packaging solutions provider in Singapore. We offer a wide range of packaging products and services to various industries. Our expertise lies in customizing packaging solutions according to the unique requirements of our clients. With a focus on innovation and quality, we strive to deliver the best packaging solutions that meet the highest industry standards. Visit our website to explore our products and services.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 30 2025

44 Patents

#60 in Singapore

#60 in Singapore

#15,298 in the World

Singapore, Singapore

Advanpack Solutions Pte Ltd.

Forward Citations = 1,315

45 inventors:

Hwee-Seng Jimmy Chew (18 out of 18 patents)

Shoa-Siong Lim (14 out of 14 patents)

Kian-Hock Lim (8 out of 8 patents)

4. Chee Kian Ong (6 out of 7 patents)

5. Shoa Siong Lim (5 out of 6 patents)

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