Kian-Hock Lim, an accomplished inventor based in Singapore, has made significant contributions to the field of semiconductor technology. With a total of eight patents to his name, his innovative work focuses on improving the efficiency and functionality of semiconductor structures and package devices.

Latest Patents

Among his latest patents, Kian-Hock Lim has developed a semiconductor structure designed for manufacturing a semiconductor package device. This invention includes a carrier, which features a first surface and a second surface opposite to the first surface. The carrier comprises an inner core layer and an exterior clad layer, with the inner core layer being covered by the exterior clad layer. Additionally, a dielectric layer is formed on the first surface of the carrier, providing essential support for the dielectric layer. His method of manufacturing semiconductor package devices showcases the impressive capabilities of the semiconductor structures he has designed.

Career Highlights

Kian-Hock Lim currently works at Advanpack Solutions Pte Ltd., where he plays an integral role in advancing semiconductor technologies. His expertise and dedication in this field have earned him recognition among peers and industry professionals alike.

Collaborations

Within his work environment, Kian-Hock Lim collaborates closely with talented colleagues, including Shoa-Siong Lim and Hwee-Seng Jimmy Chew. Their combined efforts contribute to the innovative spirit at Advanpack Solutions, driving the development of cutting-edge semiconductor products.

Conclusion

Kian-Hock Lim's contributions to the semiconductor industry exemplify the vital role of innovation in technology development. As he continues to push the boundaries of semiconductor structures and package devices, his work will undoubtedly influence future advancements in this critical field.

Profile summary based on public USPTO records.

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