The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 29, 2014
Filed:
Aug. 31, 2011
Hwee-seng Jimmy Chew, Singapore, SG;
Kian-hock Lim, Singapore, SG;
Oviso Dominador Jr Fortaleza, Singapore, SG;
Shoa-siong Raymond Lim, Singapore, SG;
Hwee-Seng Jimmy Chew, Singapore, SG;
Kian-Hock Lim, Singapore, SG;
Oviso Dominador Jr Fortaleza, Singapore, SG;
Shoa-Siong Raymond Lim, Singapore, SG;
Advanpack Solutions Pte Ltd., Singapore, SG;
Abstract
A conductive carrier having a first surface and a second surface is provided. The conductive trace layer is formed on the second surface of the conductive carrier. A conductive stud layer is formed on the conductive trace layer. A dielectric layer is formed on the conductive layer to encapsulate the conductive trace layer and the conductive stud layer. The conductive stud layer is exposed. A plating conductive layer is formed to envelop the conductive carrier, the dielectric layer and the exposed end of the conductive stud layer. A cavity is formed on the conductive carrier, wherein the conductive trace layer and the dielectric layer are exposed in the cavity. A surface finishing is formed on at least an exposed portion of the conductive stud layer. The plating conductive layer is removed.