Shoa-Siong Lim

This inventor holds 14 USPTO granted patents and 2 published patent applications. Top assignee: Advanpack Solutions Pte Ltd.. Active years: 2014-2020.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Shoa-Siong Lim. Retrieved from https://idiyas.com/inventor/shoa-siong-lim

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 14 (Patent Applications = 2)

% Patents Active = 100.0

Average Co-Inventor Count = 2.6

ph-index = 3

Forward Citations = 22(Granted Patents)

Company Filing History:

14 out of 44

Advanpack Solutions Pte Ltd.

patents

Years Active: 2014-2020

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14 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 10763133 - Semiconductor structure and semiconductor package device using the same (2020-09-01),

2. 10154588 - Manufacturing method of semiconductor package (2018-12-11),

3. 10109503 - Method of manufacturing semiconductor package device (2018-10-23),

4. 9892916 - Manufacturing method of package substrate and package manufacturing method of semiconductor device (2018-02-13),

5. 9723717 - Substrate structure, semiconductor package device, and manufacturing method of semiconductor package (2017-08-01),

6. 9653323 - Manufacturing method of substrate structure having embedded interconnection layers (2017-05-16),

7. 9583449 - Semiconductor package (2017-02-28),

8. 9379044 - Package carrier, package carrier manufacturing method, package structure for semiconductor device and manufacturing method thereof (2016-06-28),

9. 9305868 - Manufacturing method of forming an etch-back type semiconductor package with locking anchorages (2016-04-05),

10. 9301391 - Substrate structure, semiconductor package device, and manufacturing method of substrate structure (2016-03-29),

11. 9219027 - Semiconductor device carrier and semiconductor package using the same (2015-12-22),

12. 9059050 - Manufacturing methods of semiconductor substrate, package and device (2015-06-16),

13. 8917521 - Etch-back type semiconductor package, substrate and manufacturing method thereof (2014-12-23),

14. 8709874 - Manufacturing method for semiconductor device carrier and semiconductor package using the same (2014-04-29),

Title: Inventor Spotlight: Shoa-Siong Lim

Introduction: Shoa-Siong Lim is a pioneering inventor hailing from Singapore, known for her groundbreaking contributions to the field of technology and innovation.

Latest Patents: Shoa-Siong Lim holds several patents in the areas of artificial intelligence, renewable energy, and sustainable technologies, showcasing her commitment to creating a more sustainable future.

Career Highlights: With a career spanning over two decades, Shoa-Siong Lim has worked with leading tech companies and research institutions to develop cutting-edge solutions that have revolutionized the industry.

Collaborations: Throughout her career, Shoa-Siong Lim has collaborated with top researchers, engineers, and scientists from around the world, fostering a culture of innovation and excellence in all her projects.

Conclusion: Shoa-Siong Lim's passion for innovation and her relentless pursuit of technological advancement continue to inspire the next generation of inventors and researchers worldwide.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

2 patents pending: