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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9301391 B1

PDFFull Text
Date of Patent:
Mar. 29, 2016

Filed:

Nov. 29, 2012

Substrate structure, semiconductor package device, and manufacturing method of substrate structure

Applicant:

Advanpack Solutions Pte Ltd., Singapore, SG;

Inventors:

Hwee-Seng Jimmy Chew, Singapore, SG;

Shoa-Siong Raymond Lim, Singapore, SG;

Assignee:

ADVANPACK SOLUTIONS PTE LTD., Singapore, SG;

Attorney:

Rabin & Berdo, P.C.

Primary Examiner:

Alexander Oscar Williams

Int. Cl.
CPC ...
H01L 23/48 (2006.01); H05K 1/09 (2006.01); H01L 21/02 (2006.01); H05K 1/03 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H05K 1/092 (2013.01); H01L 21/02697 (2013.01); H01L 21/486 (2013.01); H01L 23/48 (2013.01); H01L 23/49861 (2013.01); H05K 1/0373 (2013.01); H05K 1/09 (2013.01); H01L 23/3107 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73265 (2013.01); H05K 2201/09118 (2013.01); H05K 2203/0574 (2013.01);
Abstract

A substrate structure includes first, second and third metal layers embedded in a dielectric layer between its opposite upper first and lower second surfaces. The entire upper surface of the first metal layer is exposed on the first surface of the dielectric layer, the entire lower surface of the third metal layer is exposed on the second surface of the dielectric layer, and the second metal layer is disposed between the first metal layer and the third metal layer, wherein the area of the third metal layer is larger than the area of the second metal layer.

Find Patent Forward Citations

Chew, Hwee-Seng. (2016). Substrate structure, semiconductor package device, and manufacturing method of substrate structure (U.S. Patent No. 9301391). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9301391

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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