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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9653323 B1

PDFFull Text
Date of Patent:
May. 16, 2017

Filed:

Mar. 04, 2016

Manufacturing method of substrate structure having embedded interconnection layers

Applicant:

Advanpack Solutions Pte Ltd., Singapore, SG;

Inventors:

Hwee-Seng Jimmy Chew, Singapore, SG;

Shoa-Siong Raymond Lim, Singapore, SG;

Assignee:

ADVANPACK SOLUTIONS PTE LTD., Singapore, SG;

Attorney:

Rabin & Berdo, P.C.

Primary Examiner:

Thomas L Dickey

Assistant Examiner:

Changhyun Yi

Int. Cl.
CPC ...
H01L 21/48 (2006.01); H01L 21/02 (2006.01); H01L 23/48 (2006.01); H05K 1/03 (2006.01); H05K 1/09 (2006.01); H01L 23/498 (2006.01); C25D 5/02 (2006.01); C25D 7/12 (2006.01); H01L 21/027 (2006.01); H01L 21/288 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/4857 (2013.01); C25D 5/022 (2013.01); C25D 7/12 (2013.01); H01L 21/0273 (2013.01); H01L 21/02697 (2013.01); H01L 21/2885 (2013.01); H01L 21/486 (2013.01); H01L 23/48 (2013.01); H01L 23/49838 (2013.01); H01L 23/49861 (2013.01); H01L 23/49866 (2013.01); H01L 23/49894 (2013.01); H05K 1/0373 (2013.01); H05K 1/09 (2013.01); H05K 1/092 (2013.01); H01L 23/3107 (2013.01); H01L 24/73 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73265 (2013.01); H05K 2201/09118 (2013.01); H05K 2203/0574 (2013.01);
Abstract

A manufacturing method of a substrate structure is provided. The method includes the following steps. Firstly, a conductive carrier is provided. Then, a first metal layer is formed on the conductive carrier. Then, a second metal layer is formed on the first metal layer. Then, a third metal layer is formed on the second metal layer, wherein each of the second metal layer and the third metal layer has a first surface and a second surface opposite to the first surface, the first surface of the third metal layer is connected to the second surface of the second metal layer, the surface area of the first surface of the third metal layer is larger than the surface area of the second surface of the second metal layer, and the first metal layer, the second metal layer and the third metal layer form a conductive structure.

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