The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 14, 2018
Filed:
Mar. 26, 2013
Applicant:
Advanpack Solutions Pte Ltd, Singapore, SG;
Inventors:
Shoa Siong Lim, Singapore, SG;
Hwee Seng Chew, Singapore, SG;
Assignee:
Advanpack Solutions Pte Ltd, Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/48 (2006.01); H01L 23/12 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 21/56 (2006.01); H01L 23/29 (2006.01); H01L 23/13 (2006.01);
U.S. Cl.
CPC ...
H01L 23/12 (2013.01); H01L 21/4842 (2013.01); H01L 21/4857 (2013.01); H01L 21/56 (2013.01); H01L 23/295 (2013.01); H01L 23/49822 (2013.01); H01L 23/49838 (2013.01); H01L 24/97 (2013.01); H01L 23/13 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/97 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15747 (2013.01); H01L 2924/181 (2013.01); Y10T 29/49121 (2015.01);
Abstract
The present invention provides a semiconductor substrate () comprising two or more layers of built-up structural layers () formed on a sacrificial carrier (). Each built-up structural layer, comprising a conductor trace layer (,) and an interconnect (), is molded in a resin molding compound. A top surface of the molded compound is abrasively ground and then deposited with an adhesion layer (). A multi-layer substrate () is then obtained after an outermost conductor trace layer () is formed on the adhesion layer and the carrier () or reinforcing ring () is removed.