The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 05, 2017
Filed:
Feb. 21, 2014
Applicant:
Advanpack Solutions Pte Ltd, Singapore, SG;
Inventors:
Shoa Siong Raymond Lim, Singapore, SG;
Hwee Seng Jimmy Chew, Singapore, SG;
Assignee:
Advanpack Solutions PTE LTD, Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/12 (2006.01); H01L 23/00 (2006.01); H01L 23/544 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/495 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/562 (2013.01); H01L 21/486 (2013.01); H01L 21/4828 (2013.01); H01L 21/4842 (2013.01); H01L 21/565 (2013.01); H01L 23/49541 (2013.01); H01L 23/544 (2013.01); H01L 23/49827 (2013.01); H01L 24/97 (2013.01); H01L 2223/54426 (2013.01); H01L 2223/54486 (2013.01);
Abstract
A semiconductor structure and a method of fabricating the same. The semiconductor structure comprises: a layer element, one or more supporting elements disposed on a first surface of the layer element, and one or more anchoring elements disposed within the layer element and connected to the one or more supporting elements to couple the one or more supporting elements to the layer element to strengthen the layer element.