Company Filing History:
Years Active: 2010-2016
Title: Ong Chee Kian: Innovator in Semiconductor Manufacturing
Introduction
Ong Chee Kian is a notable inventor based in Singapore, recognized for his contributions to semiconductor manufacturing. With a total of two patents to his name, he has made significant strides in the field, showcasing his expertise and innovative spirit.
Latest Patents
Ong's latest patents include a method of manufacturing a semiconductor element and a semiconductor package for fine pitch miniaturization. The first patent outlines a method that involves providing a carrier and a mold, forming a first patterned conductive layer on the carrier, and encapsulating it with a molding material. This process ensures that the plurality of traces embedded in the molding material remains intact and unaffected. The second patent describes a semiconductor package that features a first insulating layer with multiple holes for positioning solder balls, allowing for efficient signal transmission from the semiconductor chip to the package traces.
Career Highlights
Ong Chee Kian is currently employed at Advanpack Solutions Pte Ltd., where he continues to develop innovative solutions in semiconductor technology. His work has contributed to advancements in manufacturing processes that enhance the performance and miniaturization of semiconductor packages.
Collaborations
Ong has collaborated with notable colleagues, including Chew Hwee-Seng Jimmy and Abd Razak Bin Chichik, further enriching his professional experience and expanding his impact in the industry.
Conclusion
Ong Chee Kian's contributions to semiconductor manufacturing through his innovative patents and collaborative efforts highlight his role as a key figure in the field. His work continues to influence advancements in technology and manufacturing processes.