The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 23, 2016
Filed:
Aug. 03, 2009
Chew Hwee-seng Jimmy, Singapore, SG;
Ong Chee Kian, Singapore, SG;
Abd. Razak Bin Chichik, Singapore, SG;
Chew Hwee-Seng Jimmy, Singapore, SG;
Ong Chee Kian, Singapore, SG;
Abd. Razak Bin Chichik, Singapore, SG;
ADVANPACK SOLUTIONS PTE LTD., Singapore, SG;
Abstract
A method of manufacturing a semiconductor element is provided. The method includes the following steps. A carrier and a mold are provided. A first patterned conductive layer including a plurality of traces is formed on the carrier. A second patterned conductive layer is formed on the first patterned conductive layer. The carrier is disposed with the mold to form at least one mold cavity. The mold cavity is infused with a molding material. The molding material fills the mold cavity to encapsulate the first and second patterned conductive layers. The carrier is removed by etching to expose the plurality of traces embedded in the molding material without affecting the width of the traces.